公开(公告)号：JP2013067506A

公开(公告)日：2013-04-18

申请号：JP2011209043

申请日：2011-09-26

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： ISHIBASHI HIDENORI ,  KIMURA TOSHIBUMI ,  ONO HIROKI

IPC: B65H31/24 ,  B65H31/32 ,  G06K13/14

Abstract: PROBLEM TO BE SOLVED: To hold thin type sheet-like substances so as not to closely contact with each other when holding the thin type sheet-like substances in a state of being layered vertically.SOLUTION: In the constitution in which the thin type sheet-like substances can be stored in the state of being layered vertically and having a storing area 30 in which the thin type sheet-like substances are stored from a top surface side, a plurality of rotating members 10a-1 to 10a-4 and 10b-1 to 10b-4 which are arranged to be paired so that they are parallel with one another while being opposed to one another across the storing area 30 and rotate with rotating rollers 11 as centers are provided in the layered direction of the thin type sheet-like substances. Comb teeth 12 provided at the rotating members 10a-1 to 10a-4 and 10b-1 to 10b-4 are aligned alternately with comb teeth 12 of the adjacent rotating members.

Abstract translation: 要解决的问题：在将薄型片状物质保持在垂直分层的状态下时，保持薄型片状物质，以便彼此不紧密接触。 解决方案：在薄型片状物质可以在垂直分层的状态下存储并且具有从上表面侧存储薄型片状物质的存储区域30的构造中， 多个旋转构件10a-1至10a-4和10b-1至10b-4，其布置成成对，使得它们彼此平行，同时跨越存储区域30彼此相对并且与旋转辊 11在薄型片状物质的分层方向上设置有中心。 设置在旋转构件10a-1至10a-4和10b-1至10b-4处的梳齿12与相邻旋转构件的梳齿12交替排列。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2011070650A

公开(公告)日：2011-04-07

申请号：JP2010149795

申请日：2010-06-30

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： ITO YUICHI ,  NAKAHARA KOSUKE ,  KIMURA TOSHIBUMI

IPC: G06K19/077 ,  B42D15/10 ,  G06K19/07

Abstract: PROBLEM TO BE SOLVED: To provide a non-contact type data receiver/transmitter which is thin, has excellent flexibility and excellent weather resistance, and can be easily manufactured, and a manufacturing method therefor. SOLUTION: The non-contact type data receiver/transmitter 10 is provided with: an inlet 11; a coating material 12 for coating one face 11a of the inlet 11; and a protective film 20 for coating end faces 11c, 11d of the inlet 11, end faces 12b, 12c of the coating material 12, and one face 12a of the coating material 12. The coating material 12 is composed of a two-part cured urethane adhesive. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种薄型，具有优异的柔性和优异的耐候性，易于制造的非接触型数据接收/发送器及其制造方法。 解决方案：非接触型数据接收/发送器10设置有：入口11; 用于涂覆入口11的一个面11a的涂料12; 以及用于涂覆入口11的端面11c，11d，涂层材料12的端面12b，12c以及涂层材料12的一个表面12a的保护膜20.涂层材料12由两部分固化 聚氨酯胶粘剂。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2010186327A

公开(公告)日：2010-08-26

申请号：JP2009030050

申请日：2009-02-12

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： SHOJI YOHEI ,  NAKAHARA KOSUKE ,  KIMURA TOSHIBUMI

IPC: G06K19/077 ,  G06K19/07

Abstract: PROBLEM TO BE SOLVED: To provide a non-contact type data reception/transmission body wherein a covering material for protecting an IC chip or an antenna is firmly fixed to an inlet without using glue or an adhesive, and to provide a method for producing the same. SOLUTION: In this non-contact type data reception/transmission body 10, a first base material 11 consists of a high molecular compound a having a methyl group in a molecular, a second base material 15 consists of a high molecular compound b having a methyl group in a molecular, a part of the high molecular compound a and a part of the high molecular compound b are bonded by a chemical bond, and a part of the first base material 11 and a part of the second base material 15 are stuck firmly to each other. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种非接触型数据接收/传输体，其中用于保护IC芯片或天线的覆盖材料牢固地固定到入口而不使用胶水或粘合剂，并提供一种方法 为了生产相同。 解决方案：在该非接触型数据收发体10中，第一基材11由分子中具有甲基的高分子化合物a构成，第二基材15由高分子化合物b 在分子中具有甲基，高分子化合物a的一部分和高分子化合物b的一部分通过化学键接合，并且部分第一基材11和第二基材15的一部分 彼此牢牢相连。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2010040749A

公开(公告)日：2010-02-18

申请号：JP2008201784

申请日：2008-08-05

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： SHOJI YOHEI ,  NAKAHARA KOSUKE ,  KIMURA TOSHIBUMI

IPC: H01L21/50 ,  H01L21/60

Abstract: PROBLEM TO BE SOLVED: To provide an electronic component transfer device capable of always transferring an electronic component in a given direction and of recovering an electronic component not set in the given direction without transferring it to a mounting process. SOLUTION: The electronic component transfer device 10 includes a pedestal 11, a component bearing portion 12 which extends on one surface 11a of the pedestal 11 and has a section perpendicular to its longitudinal direction that is in a trapezoidal shape, and a projecting stripe portion 13 placed on the upper surface 12a of the component bearing portion 12 along its longitudinal direction. When the width of the upper surface 12a of the component bearing portion 12 is d 1 and the width of an electronic component 20 is d 2 , d 1 ≤d 2 is satisfied. When the height of the projecting stripe portion 13 is d 3 and the length of a terminal 21 of the electronic component 20 is d 4 , d 3 ≤d 4 is satisfied. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种能够总是在给定方向上传送电子部件的电子部件传送装置，以及在不将其转移到安装处理的情况下回收未设定在给定方向上的电子部件。 电子部件传送装置10包括基座11，在基座11的一个表面11a上延伸并具有与其长度方向垂直的截面为梯形的部件支承部12， 条状部分13沿着其纵向方向放置在部件支承部分12的上表面12a上。 当部件承载部12的上表面12a的宽度为d 1 时，电子部件20的宽度为d 2 ，d SB>≤d 2 。 当突出条纹部13的高度为d 3 时，电子部件20的端子21的长度为d 4 时，d SB = 3 >≤d 4 。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2010028015A

公开(公告)日：2010-02-04

申请号：JP2008190852

申请日：2008-07-24

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： SHOJI YOHEI ,  NAKAHARA KOSUKE ,  KIMURA TOSHIBUMI

IPC: H01L21/60

CPC classification number: H01L24/81 ,  H01L2224/13 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/8159 ,  H01L2224/816 ,  H01L2224/81862 ,  H01L2224/83886 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a component mounting substrate, which can simply reinforce a junction part between a conductive portion and an electronic component on the substrate and can prevent the electronic component from being peeled off from the junction part due to an environmental change. SOLUTION: The method for manufacturing the component mounting substrate includes: a process A for forming coated films 2 composing conductive portions by applying a polymer type conductive ink to one surface 1a of the substrate 1; a process B for disposing an electronic component 11 on one surface 1a of the substrate 1 so that terminals 12, 12 of the electronic component 11 are abutted on the coated films 2 configuring a pair of electrodes of the conductive portions; and a process C for applying an electric field between the other surface 1b of the substrate 1 and the electronic component 11 and moving conductive particulates included in the coated films 2 to the peripheries of the terminals 12, 12 of the electronic component 11. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于制造部件安装基板的方法，其可以简单地加强基板上的导电部分和电子部件之间的接合部分，并且可以防止电子部件从接合部剥离 部分由于环境变化。 解决方案：用于制造部件安装基板的方法包括：通过在基板1的一个表面1a上施加聚合物型导电油墨来形成构成导电部分的涂膜2的工艺A; 用于将电子部件11设置在基板1的一个表面1a上的处理B，使得电子部件11的端子12,12抵接在构成导电部分的一对电极的涂膜2上; 以及用于在基板1的另一个表面1b和电子部件11之间施加电场并将包括在涂膜2中的移动的导电颗粒施加到电子部件11的端子12,12的周边的工艺C.

版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2008058450A

公开(公告)日：2008-03-13

申请号：JP2006233144

申请日：2006-08-30

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： KIMURA TOSHIBUMI ,  TOSEI DAISUKE ,  YOSHIDA RIE

IPC: G09F3/00 ,  B31D1/02 ,  G09F3/10

Abstract: PROBLEM TO BE SOLVED: To provide a label continuous body comprising a label base body provided with a release paper via an adhesive agent for later manufacturing a continuous label by separating label waste from the release paper while making labels remain on the releasing paper, a continuous label manufacturing device for manufacturing a continuous label from the label continuous body, and a continuous label manufacturing method, and to avoid fall in yield ratio and in manufacturing efficiency by surely making labels remain on the release paper.
SOLUTION: On the label continuous body 11, an intermediate cutting line 18 is formed in the transport direction in a label waste intermediate section 17 between each area of a label section 16 formed by a label cutting line 15 on the label base body 12. When the continuous label 20 is manufactured, by separating the label wastes 12a and 12B by the intermediate cutting line 18 in the direction broadening toward the end from the time of splitting the label wastes with a waste removing roller 21, the label wastes 12A and 12B are separated with the label 16A surely remaining on the release paper 14.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种标签连续体，其包括经由粘合剂设置有剥离纸的标签基体，用于随后通过将标签废物从剥离纸分离而制造连续标签，同时使标签保留在脱模纸上 ，用于从标签连续体制造连续标签的连续标签制造装置和连续标签制造方法，并且通过可靠地使标签保留在剥离纸上来避免成品率下降和制造效率。 解决方案：在标签连续体11上，在标签废物中间部分17的输送方向上形成中间切割线18，该标签废物中间部分17在由标签基体上的标签切割线15形成的标签部分16的每个区域之间 当制造连续标签20时，通过中间切割线18从标签废物与废弃物去除辊21分离时朝向开始的方向分离标签废物12a和12B，标签废物12A 和12B分开，标签16A确实保留在脱模纸14上。版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2006323716A

公开(公告)日：2006-11-30

申请号：JP2005147614

申请日：2005-05-20

Applicant: TOPPAN FORMS CO LTD

Inventor： KIMURA TOSHIBUMI ,  OKADA TAKAAKI

IPC: G06K19/077 ,  B42D15/10

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing IC cards to which a reinforcing plate is arranged for preventing breakage in order to secure an electrical continuity on mounting and suppress loss of quality and reduction of yield. SOLUTION: A predetermined amount of adhesive is supplied to the adhesion surface of a predetermined size of the reinforcing plate, the adhesive surface of the IC chip is contacted with the adhesive surface of the reinforcing plate by a holding means for exposing the adhesive surface of the IC chip and holding the IC chip, and the IC chip is pressed and shaken against the adhesive surface of the reinforcing plate with a predetermined pressure to be adhered to it. The IC chip to which the reinforcing plate is adhered is mounted on a pattern formed on a base material with a bump of the IC chip electrically connected to the pattern. COPYRIGHT: (C)2007,JPO&INPIT

公开(公告)号：JP2005212356A

公开(公告)日：2005-08-11

申请号：JP2004023551

申请日：2004-01-30

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： ENDO YASUHIRO ,  KIMURA TOSHIBUMI ,  TAKAHASHI HIRONARI

IPC: B42D15/10 ,  G06K19/077

Abstract: PROBLEM TO BE SOLVED: To prevent an adhesive from adhering to a chip installing head for installing an IC chip when the IC chip is bonded onto a sheet board through the adhesive. SOLUTION: Under the condition that a hot melt layer 30 laminated onto a resin sheet 2, which is turned into a strip-like resin layer by being cut out, is kept under being fused, the IC chip 10 is jetted against the hot melt layer 30 so as to embed the IC chip 10 in the fused hot melt layer 30 by the jetting force of the IC chip 10. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：当IC芯片通过粘合剂粘合到片材板上时，防止粘合剂粘附到用于安装IC芯片的芯片安装头。 解决方案：在通过切割成层压到变成条状树脂层的树脂片材2上的热熔层30被保持熔化的条件下，IC芯片10被喷射到 热熔层30，以便通过IC芯片10的喷射力将IC芯片10嵌入熔融热熔层30中。（C）2005，JPO＆NCIPI

公开(公告)号：JP2003137473A

公开(公告)日：2003-05-14

申请号：JP2001334184

申请日：2001-10-31

Applicant: TOPPAN FORMS CO LTD

Inventor： KIMURA TOSHIBUMI ,  MATSUYAMA TETSUYA

IPC: B65H35/04

Abstract: PROBLEM TO BE SOLVED: To provide a continuous form processing device capable of efficiently processing a continuous form without degradation of an operation rate of a specific cutting processing part. SOLUTION: This device is provided with a conveying part 3 including a conveying passage 3a moving along a predetermined path, for conveying an object mounted on the conveying passage, a first cutting processing part 1 for sequentially cutting the continuous form 11 in unit paper sheets 11a, and sequentially mounting each of the unit paper sheets on the conveying passage, a second cutting processing part 2 for sequentially cutting the continuous form 12 in unit paper sheets 12a and sequentially mounting each of the unit paper sheets on the conveying passage, and a control part 4 for controlling switching between the first cutting processing part and the second cutting processing part, and movement of the conveying passage in the conveying part.

公开(公告)号：JP2011209985A

公开(公告)日：2011-10-20

申请号：JP2010076790

申请日：2010-03-30

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： KIMURA TOSHIBUMI ,  NAKAHARA KOSUKE ,  ITO YUICHI

IPC: G06K19/077 ,  G06K19/07

Abstract: PROBLEM TO BE SOLVED: To provide a non-contact type data reception/transmission body easy to be handled, not stuck to the other sheet-like IC tag even if it is lapped on the IC tag, and to provide a method for manufacturing the same.SOLUTION: This non-contact type data reception/transmission body 10 includes an inlet 11, and covering materials 12 covering both faces 11a, 11b of the inlet 11. The covering material 12 is composed of a two-liquid mixing type polyurethane resin, and faces 12a, 12b opposite to faces of the covering materials 12 contacting with the inlet 11, and at least a part of the vicinity thereof have areas 13e, 14e having a large number of bubbles 13d, 14d.

Abstract translation: 要解决的问题：为了提供易于处理的非接触型数据接收/发送体，即使在IC标签上搭载，也不会粘在另一片状IC标签上，并且提供一种制造方法 相同。解决方案：该非接触型数据接收/发送主体10包括入口11和覆盖入口11的两个面11a，11b的覆盖材料12.覆盖材料12由双液混合型聚氨酯树脂 和与入口11接触的覆盖材料12的面相对的面12a，12b，其附近的至少一部分具有大量气泡13d，14d的区域13e，14e。