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公开(公告)号：US20210351094A1
公开(公告)日：2021-11-11
申请号：US17376534
申请日：2021-07-15
Applicant: TOPPAN PRINTING CO., LTD.
Inventor： Yuki UMEMURA , Akane KOBAYASHI
Abstract: A package substrate that prevents breakage of a core substrate is provided. A package substrate includes a core substrate made of a brittle material, at least one insulating layer formed on one surface or both surfaces of the core substrate, and one or more wiring layers formed on the insulating layer and/or in the insulating layer, the core substrate being exposed from an outer peripheral portion of the insulating layer, and the insulating layer being chamfered.
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