1.
    发明专利
    未知

    公开(公告)号:DE69723541D1

    公开(公告)日:2003-08-21

    申请号:DE69723541

    申请日:1997-08-01

    Abstract: Cards which contain any one of the following thermoplastic resin compositions I to III in its material can be used as magnetic cards, IC cards, etc. since they are excellent in heat resistance, processability and embossability: I. A composition consisting of the following ingredients (A) and (B) II. A composition consisting of the following ingredients (A), (B) and (D) III. A composition consisting of 100 parts by weight of one or more selected from the following ingredients (A), (B) and (D) and 2 to 25 parts by weight of the following ingredient (C> (In the above I to III, the ingredient A is a polyester composed of dicarboxylic acid components with terephthalic acid component as a main dicarboxylic acid component and ethylene glycol component (I) and 1,4-cyclohexanedimethanol component (II) as main glycol components, with the molar ratio (I)/(II) of ethylene glycol component (I) to 1,4-cyclohexanedimethanol component (II) kept at 1 or more; the ingredient B is an aromatic polycarbonate; the ingredient C is an inorganic sheet-like filler of 0.5 to 20 mu m in average grain size; and the ingredient (D) is a polyester composed of dicarboxylic acid components with terephthalic acid component as a main dicarboxylic acid component and ethylene glycol component (I) and 1,4-cyclohexanedimethanol component (II) as main glycol components, with the molar ratio (I)/(II) of ethylene glycol component (I) to 1,4-cyclohexanedimethanol component (II) kept at smaller than 1.) o

    POLYESTER RESIN COMPOSITION
    2.
    发明专利

    公开(公告)号:JPH10101918A

    公开(公告)日:1998-04-21

    申请号:JP21032097

    申请日:1997-08-05

    Abstract: PROBLEM TO BE SOLVED: To provide a polyester resin composition having heat resistance higher than those of a binary compatible polycarbonate (PC)/1,4-cyclohexanedimethanol(CHDM) derivative copolyester system and a binary incompatible PC/CHDM derivative copolyester system and having good mechanical properties. SOLUTION: This composition comprises a polyester (A) comprising dicarboxylic acid units based on terephthalic acid(TPA) units and glycol units based on ethylene glycol(EG) units (I) and CHDM units (II) and having a (I) to (II) molar ratio of 1 or above, a polyester (B) comprising dicarboxylic acid units based on TPA units (II) and glycol units based on EG units and CHDM units (II) and having a (I) to (II) molar ratio of below 1, and an aromatic PC (C).

    MULTILAYER SHEET AND CARD MADE THEREOF

    公开(公告)号:JPH11227136A

    公开(公告)日:1999-08-24

    申请号:JP2874498

    申请日:1998-02-10

    Abstract: PROBLEM TO BE SOLVED: To suppress the warpage of a card due to embossing by a method wherein a lamination form, the density distribution to the direction of the thickness of inorganic flake-like filler satisfies the formulae I and II is taken. SOLUTION: In order to form a single layer sheet, a plurality of which compose a multilayer sheet, the loaidngs of an inorganic flake-like filler, the particle form of which is nonisotropic three-dimensionally and has a biaxial orientational property, is preferably 2-25 pts.wt. to 100 pts.wt. of 1 or 2 or more of thermoplastic resins selected from the group consisting of an amorphous polyester and an aromatic polycarbonate. In the multilayer sheet produced by laminating at least these two or three or more single layer sheets, when let the thickness of the multilayer sheet be 2L, the X-axis be in the direction of the thickness, the origin of the X-axis be the center of the multilayer sheet, the density of the inorganic flake-like filler at X be C(X), the single layer sheets are laminated in the form of the multilayer sheet, in which the resultant density distribution of the inorganic flake-like filler in the direction of the thickness satisfy the formulae I and II. In other words, the density distribution of the inorganic flake-like filler in the direction of the thickness is formed through such as laminating fashion that the density in the outer layer is made higher than that in the inner layer, resulting in remarkably improving the embossing characteristics of the multilayer sheet.

    MULTILAYERED POLYESTER SHEET
    4.
    发明专利

    公开(公告)号:JPH10100356A

    公开(公告)日:1998-04-21

    申请号:JP21031997

    申请日:1997-08-05

    Abstract: PROBLEM TO BE SOLVED: To provide a multilayered polyester sheet capable of being thermally fused at practical temp. of about 110-150 deg.C in spite of its high heat resistance. SOLUTION: This multilayered polyester sheet is obtained by laminating two or more sheets and at least one layer is constituted of a sheet A composed of a resin compsn. consisting of polyester (A-1) composed of a glycol unit based on dicarboxylic acid unit based on a terephthalic acid unit and ethylene glycol unit (I) and a glycol unit based on 1,4-cyclohexanedimethanol unit (II) and characterized by that a mol ratio (I)/(II) of the ethylene glycol unit (I) and a 1,4- cyclohexanedimethanol unit (II) is 1 or more and aromatic polycarbonate (A-2).

    BIAXIALLY ORIENTED POLYPROPYLENE FILM

    公开(公告)号:JP2001072778A

    公开(公告)日:2001-03-21

    申请号:JP2000195683

    申请日:2000-06-29

    Abstract: PROBLEM TO BE SOLVED: To provide a biaxially oriented polypropylene film being desirable for packaging, capacitors, etc., having a surface having excellent protrusion uniformity and a high roughness density, and being excellent in recyclability. SOLUTION: This film comprises a polypropylene satisfying the relationships: log(MS)>-0.56log(MFR)+0.74, wherein MS (cN) is a melt tension as measured at 230 deg.C, and MFR (g/10 min) is a melt flow rate as measured at 230 deg.C. It is desirable that the centerline average surface roughness Ra on at least one surface of the film is in the range of 0.03-0.50 μm, and the ratio Rt/Ra is in the range of 5-12, wherein Rt is the maximum surface roughness, and Ra is the centerline average surface roughness.

    BIAXIALLY ORIENTED POLYPROPYLENE FILM

    公开(公告)号:JP2001048998A

    公开(公告)日:2001-02-20

    申请号:JP2000158266

    申请日:2000-05-29

    Abstract: PROBLEM TO BE SOLVED: To obtain a biaxially oriented polypropylene film having excellent heat resistance, breakdown resistance characteristics and proper heat shrinkability useful as a film for a film for a capacitor. SOLUTION: This biaxially oriented polypropylene film has two or more endothermic peaks caused by melting when measured by a differential scanning calorimeter in which one of the peaks is higher than 160 deg.C and the other is in the range of 130-155 deg.C. The film has >=85 J/g total melt calorie and 0.02-0.2 μm average surface roughness Ra of central line on at least one side of the film.

    THERMOPLASTIC RESIN COMPOSITION AND SHEET OR CARD MADE THEREFROM

    公开(公告)号:JPH111607A

    公开(公告)日:1999-01-06

    申请号:JP9888098

    申请日:1998-04-10

    Abstract: PROBLEM TO BE SOLVED: To obtain a thermoplastic resin composition which can give magnetic cards or IC cards excellent in heat resistance, durability and mechanical strengths and capable of being embossed by mixing a thermoplastic resin selected among polyesters and aromatic polycarbonates with a platy inorganic filler having a specified mean particle diameter in a specified ratio. SOLUTION: 100 pts.wt., in total, at least one member selected among polyesters and aromatic polycarbonates is mixed with 2-25 pts.wt. platy inorganic filler having a mean particle diameter of 0.5-20 μm. The platy inorganic filler is exemplified by talc, kaolin, mica or glass flakes. Among them, talc is the most desirable. The polyester is desirably polyethylene terephthalate, polybutylene terephthalate or polycyclohexanedimethylene terephthalate. The aromatic polycarbonate is desirably one obtained from bisphenol A.

    THERMOPLASTIC RESIN COMPOSITION AND SHEETS AND CARDS MADE FROM THE SAME
    8.
    发明公开
    THERMOPLASTIC RESIN COMPOSITION AND SHEETS AND CARDS MADE FROM THE SAME 失效
    热可塑性塑料组成,薄膜由其制得和卡

    公开(公告)号:EP0857749A4

    公开(公告)日:2000-08-30

    申请号:EP97933891

    申请日:1997-08-01

    Abstract: Cards made from any one of the following thermoplastic resin compositions (I to III), having an excellent balance among heat resistance, moldability, and embossability, and hence utilizable in magnetic cards, IC cards and the like. (I) A composition comprising a blend of the following components (A and B). (II) A composition comprising a blend of the following components (A, B and D). (III) A composition comprising a blend of at least one member selected from among the components (A, B and D) with the component (C), the content of the component (C) being 2 to 25 parts by weight based on 100 parts by weight in total of the components (A, B and D). In the compositions (I) to (III), the component (A) is a polyester comprising dicarboxylic acid units composed mainly of terephthalic acid units and glycol units composed mainly of ethylene glycol units (I) and 1,4-cyclohexanedimethanol units (II), and the molar ratio of the ethylene glycol units (I) to the 1,4-cyclohexanedimethanol units (II) is not less than 1; the component (B) is an aromatic polycarbonate; the component (C) is an organic flaky filler having an average particle diameter of 0.5 to 20 νm; and the component (D) is a polyester comprising dicarboxylic acid units composed mainly of terephthalic acid units and glycol units composed mainly of ethylene glycol units (I) and 1,4-cyclohexanedimethanol units (II), and the molar ratio of the ethylene glycol units (I) to the 1,4-cyclohexanedimethanol units (II) is less than 1.

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