1.
    发明专利
    未知

    公开(公告)号:DE60232007D1

    公开(公告)日:2009-05-28

    申请号:DE60232007

    申请日:2002-10-28

    Abstract: The present invention relates to a photosensitive ceramic composite and a method for manufacturing a multilayer substrate using the composite. The photosensitive ceramic composite and manufacturing method of the present invention are applicable to circuit members and components for ceramic multilayer substrates for high-frequency wireless communication. The photosensitive ceramic composite contains inorganic particles and a photosensitive organic component. The inorganic particles have at least surface sections containing an inorganic material having a refractive index less than that of inner sections of the inorganic particles.

    2.
    发明专利
    未知

    公开(公告)号:AT428956T

    公开(公告)日:2009-05-15

    申请号:AT02779925

    申请日:2002-10-28

    Abstract: The present invention relates to a photosensitive ceramic composite and a method for manufacturing a multilayer substrate using the composite. The photosensitive ceramic composite and manufacturing method of the present invention are applicable to circuit members and components for ceramic multilayer substrates for high-frequency wireless communication. The photosensitive ceramic composite contains inorganic particles and a photosensitive organic component. The inorganic particles have at least surface sections containing an inorganic material having a refractive index less than that of inner sections of the inorganic particles.

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