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公开(公告)号:SG11201407832XA
公开(公告)日:2015-01-29
申请号:SG11201407832X
申请日:2013-06-13
Applicant: TORAY INDUSTRIES
Inventor: NAGASE RYO , YAMADA TOMONORI , IKEGAMI YOSHIHIRO , NONAKA HARUSHI
IPC: G02B5/20 , G02F1/1335 , G09F9/30
Abstract: The invention provides a colour filter wherein a black matrix is formed on a transparent substrate and pixels comprising red auxiliary pixels, green auxiliary pixels, blue auxiliary pixels and auxiliary pixels of a fourth colour are formed at the aperture of this black matrix or at the aperture of this black matrix and on this black matrix. The width (L1) of the black matrix between the aforementioned auxiliary pixels of the fourth colour and the other auxiliary pixels is to 4.5 μm. The auxiliary pixels contain respective colorant and resin. The tristimulus value (Y) according to the CIE1931 colour system of the aforementioned auxiliary pixels of the fourth colour is 70≦̸Y≦̸99.
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公开(公告)号:JP2002082426A
公开(公告)日:2002-03-22
申请号:JP2000270240
申请日:2000-09-06
Applicant: TORAY INDUSTRIES
Inventor: KAKINUKI TAKEHIRO , YAMADA TOMONORI , GOTO TETSUYA , SUZUKI TETSUO
IPC: G02F1/1335 , B08B3/08 , B08B7/04 , G03F1/82 , G03F1/08
Abstract: PROBLEM TO BE SOLVED: To provide a cleaning method and cleaning device for photomask which effectively remove the foreign matter existing on a photomask. SOLUTION: This cleaning method for photomask consists of irradiating a photomask with UV light for a specified time by using a UV irradiation device of 170 to 180 nm in wavelength of >=90% of the total generated UV light, then cleaning this photomask by using an alkaline cleaning liquid.
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公开(公告)号:JPH11262718A
公开(公告)日:1999-09-28
申请号:JP6672398
申请日:1998-03-17
Applicant: TORAY INDUSTRIES
Inventor: YAMADA TOMONORI , GOTO TETSUYA , SUZUKI TETSUO , KAKINUKI TAKEHIRO
IPC: B05D1/26 , B05C5/02 , G03F7/16 , G03F7/30 , H01L21/027
Abstract: PROBLEM TO BE SOLVED: To uniformly treat the lower surface of an object to be treated with a small quantity of chemical liquid by operating a chemical liquid application means to discharge the chemical liquid from a gap between a plain plate and another plain plate opposite to the former. SOLUTION: The lower surface of, for example, a 620W×720L×0.7 t glass substrate 3 is treated with a chemical liquid. The chemical liquid to be used is MCA. The discharge amount of the chemical liquid is 200 ml/min. Further, the upper face of an aqua-knife 1 and the lower surface of the glass substrate 3 are to be 5 mm distant and it is checked whether the chemical liquid is uniformly supplied to the lower surface of the glass substrate 3. In addition, tests are performed by changing the distance(d) between the upper face of the aqua-knife 1 and the lower surface of the glass substrate 3 to obtain the maximum value of the distance(d) at which the chemical liquid can be uniformly supplied to the lower surface of the glass substrate 3. At the time, when the distance(d) between the upper face of the aqua-knife 1 and the lower surface of the glass substrate 3 is 5 mm, the chemical liquid is supplied uniformly to the lower surface of the glass substrate 3 but the supply amount is a little insufficient. In order to supply the chemical liquid sufficiently, the distance(d) should be 3 mm.
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公开(公告)号:JPH11174688A
公开(公告)日:1999-07-02
申请号:JP34762897
申请日:1997-12-17
Applicant: TORAY INDUSTRIES
Inventor: YAMADA TOMONORI , GOTO TETSUYA , SUZUKI TETSUO , YOSHIOKA MASAHIRO , KAKINUKI TAKEHIRO , TOMIMATSU SHINJI
IPC: G02B5/20 , B05C13/00 , G03F7/30 , H01L21/027 , H01L21/304
Abstract: PROBLEM TO BE SOLVED: To provide an even chemical treatment without generating spotted unevenness due to bubbles and mist by supplying chemical on a material to be treated, and carrying it for the predetermined time while holding the chemical. SOLUTION: A material to be treated is carried on a pass line 6 from left to right, while being treated by chemical. The chemical is supplied from a chemical supplying means 1 so as to form a chemical layer on the material to be treated. The material to be treated is carried while holding the chemical and chemical treatment is performed is carrying. The degradated chemical by treating the material to be treated is replaced with new chemical by a chemical replacing means 3, and chemical treatment of the material to be treated is further proceeded. Then the chemical is eliminated from the material to be treated by a washing shower 4 to finish the chemical treatment of the material to be treated. Finally, a water cutting means 5 such as an air knife squeeze water on the material to be treated to finish all the process of the chemical treatment. Carrying method is selected in response to the shape of the material to be treated, and a method for horizontally holding the material to be treated is desirable.
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公开(公告)号:JP2002196125A
公开(公告)日:2002-07-10
申请号:JP2000392470
申请日:2000-12-25
Applicant: TORAY INDUSTRIES
Inventor: KAKINUKI TAKEHIRO , GOTO TETSUYA , YAMADA TOMONORI
IPC: G02B5/20 , G02F1/1335 , G03F1/38 , G03F7/20 , G03F1/08
Abstract: PROBLEM TO BE SOLVED: To readily change patterns of a photomask, which has been very expensive and difficult to carry out. SOLUTION: In the method for manufacturing a pattern substrate for a liquid crystal display device, a metal film or a non-photosensitive resin layer is applied on a substrate and further a photosensitive resist is laminated, or a color resist is applied on the substrate, the substrate is subjected to an exposure process to be irradiated with UV rays through a photomask and then to a developing process to form a specified pattern on the substrate. In this method, a plurality of patterns are disposed on the photomask, and the patterns not required of transfering are shielded against light, so that patterns which are not necessary on the substrate are made to be unrecognizable.
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公开(公告)号:JP2002040223A
公开(公告)日:2002-02-06
申请号:JP2000221892
申请日:2000-07-24
Applicant: TORAY INDUSTRIES
Inventor: YAMADA TOMONORI , NARITA ISAO , SUZUKI TETSUO
Abstract: PROBLEM TO BE SOLVED: To provide a holding member for the objective body to be heated so as not to leave transfer traces on the objective body to be heated, and to provide a heating furnace. SOLUTION: The holding member is used to hold the objective body to be heated when the objective body is heated by using a heating source, and the holding member has
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公开(公告)号:JP2000320977A
公开(公告)日:2000-11-24
申请号:JP13288699
申请日:1999-05-13
Applicant: TORAY INDUSTRIES
Inventor: YAMADA TOMONORI , GOTO TETSUYA , SUZUKI TETSUO , TANAKA SATOSHI
Abstract: PROBLEM TO BE SOLVED: To prevent uneven heating at an effective section or generation of a transfer flaw in a carrying means in a heating furnace comprising a hot plate having a heating source, and a reflector disposed on the opposite side and carrying an article to be heated along the air gap between them through the carrying means by making the fixing position of the carrying means variable. SOLUTION: An article 2 to be heated, e.g. a glass substrate, is carried while being supported by a finger shuttle type finger 3 along the air gap between a hot plate 1 and a reflector 11 and heat treated during the carrying process. The finger 3 is inserted into the lower part of the article 2 held by a proxy pin 4 on an n-th hot plate 1. The article is lifted up through elevation of the finger 3 and advanced at a predetermined pitch and after being moved above an (n+1)th hot plate 1, the article 2 is transferred onto the (n+1)th hot plate 1 through lowering of the finger 3. The article 2 is advanced sequentially by repeating the operation.
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公开(公告)号:JPH11257865A
公开(公告)日:1999-09-24
申请号:JP5702998
申请日:1998-03-09
Applicant: TORAY INDUSTRIES
Inventor: YAMADA TOMONORI , GOTO TETSUYA , SUZUKI TETSUO , TANAKA SATOSHI
Abstract: PROBLEM TO BE SOLVED: To equalize thermal hysteresis of respective heating furnaces by disposing a plurality of heating furnaces for heating an object by passing it through an air gap between a hot plate and a reflector vertically and providing an air gap at least between the heating furnaces. SOLUTION: Air gaps 7a, 7c are provided, respectively, above an upper stage heating furnace and below a lower stage heating furnace. An exhaust opening 8a is provided at the upper air gap 7a, an exhaust opening 8b and a suction opening 9b are provided at an intermediate air gap 7b, and a suction opening 9c is provided at a lower air gap 7c. An air flow heated by the lower stage heating furnace is not conducted between heating furnaces but discharged from the exhaust opening 8a, 8b or the suction opening 9b, 9c to the outside and air flow across the stages can be suppressed. Since difference in the reaching temperature or the temperature profile caused by the installing position of heating furnace can be suppressed, a product of uniform quality can be obtained using any heating furnace.
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公开(公告)号:JPH11183038A
公开(公告)日:1999-07-06
申请号:JP34915797
申请日:1997-12-18
Applicant: TORAY INDUSTRIES
Inventor: YAMADA TOMONORI , GOTO TETSUYA , SUZUKI TETSUO , TANAKA SATOSHI
IPC: G02F1/13 , F27B17/00 , G02F1/1335 , H05B3/00 , H05B3/62
Abstract: PROBLEM TO BE SOLVED: To provide a heating furnace for uniformly heating a work, irrespective of its size. SOLUTION: The furnace has a heating position of a size enough to heat one work. This position is composed of heating sources 1a-1c capable of independent temp. settings. Or in addition to these independent temp. setting type source 1a-1c, temp. detecting means may be provided for independently controlling the heat sources 1a-1c, based on the temp. detection result.
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公开(公告)号:JPH11257864A
公开(公告)日:1999-09-24
申请号:JP5702898
申请日:1998-03-09
Applicant: TORAY INDUSTRIES
Inventor: YAMADA TOMONORI , GOTO TETSUYA , SUZUKI TETSUO , TANAKA SATOSHI
Abstract: PROBLEM TO BE SOLVED: To eliminate trace of a pin caused on the surface of a substrate due to uneven heating by disposing a hot plate above an object to be heated thereby preventing a generated sublimate from adhering, as a foreign matter, to the surface of the substrate. SOLUTION: A reflector 2 and a glass substrate 4 are held by pins 3 and a high temperature hot plate(HP) 1 is set above the glass substrate 4 while opening the side face 5 of a heating furnace. The HP 1 is made of a metal, e.g. aluminum, iron or copper, preferably subjected to surface treatment of ceramic, for example, and an electric heater is employed as a heating source. Since a high temperature hot plate(HP) 1 is set above an object to be heated, a generated sublimate is not deposited on the object and a foreign matter is not generated. Consequently, undue temperature rise of pin can be prevented while ensuring uniform in-plane heating of the substrate and stabilized transportation.
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