公开(公告)号：JPH03199380A

公开(公告)日：1991-08-30

申请号：JP33946189

申请日：1989-12-27

Applicant: TOSHIBA CORP

Inventor： UTSUKA RIYUUICHI ,  HAMAMURA KIYOTO ,  ARAMAKI NARIMITSU

IPC: C23C18/14

Abstract: PURPOSE:To form an organometallic compd. into a metallic film under low-temp. conditions without damaging a substrate by heating an organometallic compd. placed on the substrate in the air to decompose the compd. and then exposing the decomposition product to plasma to remove the org. matter. CONSTITUTION:An organometallic compd. is diluted with a diluent, if necessary, and applied on the substrate. The substrate on the substrate is heated in the air or in an oxygen atmosphere and calcined to decompose the compd. The calcined substrate is exposed to plasma to remove the org. matter produced by decomposition. The calcination and plasma treatment are preferably carried out at 200-400 deg.C. An inert gas contg. about 0.01-10% oxygen is preferably used for the plasma treating atmosphere when a noble metal is used, and a reducing gas such as ammonia is used when a base metal is used. Consequently, the organometallic compd. is formed into a metallic film under low-temp. conditions, and the metallic film is formed without damaging the substrate contg. a low- melting-point material.

公开(公告)号：JPH03158498A

公开(公告)日：1991-07-08

申请号：JP29887089

申请日：1989-11-17

Applicant: TOSHIBA CORP

Inventor： TAKASHIMA SEIKICHI ,  HAMAMURA KIYOTO ,  UTABA RIYUUICHI

IPC: C25D5/08 ,  C25D21/10

Abstract: PURPOSE:To form a uniform and good-quality plating layer over the entire surface to be plated at the time of locally plating a member to be plated having a flat surface by directing the surface downward in a plating soln. and providing an agitator between the surface and an anode at the bottom of a plating bath to uniformly agitate the soln. CONSTITUTION:A long-sized member 21 to be plated consisting of a ceramic substrate having a thin vapor-deposited film 22 on its surface is placed at the upper opening of a plating bath 11, and both side surfaces are covered with a 'Teflon(R)' mask 23 to leave a narrow surface 24 to be plated. A Cu anode 13 is arranged at the bottom of the bath 11 which is filled with a plating soln., a current is applied between the anode 13 and the film 22, and the exposed surface 24 is electroplated. In this case, the plating soln. is sufficiently agitated by the agitator 14 consisting of a shaft 15 and an impeller 16 and provided between the anode 13 and the surface 24 or by the inert gas bubbles 35 discharged from a tube 33 furnished along the surface 44 to be plated, and a Cu plating layer uniform in thickness is formed on the slender surface 24 or 44.

公开(公告)号：JPS6348892A

公开(公告)日：1988-03-01

申请号：JP19205986

申请日：1986-08-19

Applicant: TOSHIBA CORP

Inventor： HAMAMURA KIYOTO

IPC: H05K3/34

公开(公告)号：JPS6323232A

公开(公告)日：1988-01-30

申请号：JP25916186

申请日：1986-10-30

Applicant: TOSHIBA CORP

Inventor： HAMAMURA KIYOTO

IPC: G11B7/09

Abstract: PURPOSE:To keep a sliding state between the bearing part, and the guide shaft of a holder blade at a good condition, and to improve the reliability of the operation of an optical pickup, by forming a uniform solid-state lubricant thin film on either plane the inner peripheral plane of the bearing part, or the outer peripheral plane of the guide shaft of the holder blade, in a range of thickness of 1-3mum. CONSTITUTION:The bearing part of the holder blade 1 having a lens holding part 1a, and the bearing part, is fitted in the guide shaft 5 provided protrusively at a pickup main body 4 in such a way that it can be moved slidably, and the holder blade is moved reciprocally in the axial direction of the guide shaft by a magnetic circuit 6. In this case, the solid-state lubricant thin film having the thickness in the range of 1-3mum, and also formed uniformly, is formed on either plane the inner peripheral plane of the bearing part, or the outer peripheral plane of the guide shaft of the holder blade. In this way, it is possible to generate a good sliding state between the bearing part, and the guide shaft of the holder blade, and to prevent the malfunction of the optical pickup from generating.

公开(公告)号：JPS6182493A

公开(公告)日：1986-04-26

申请号：JP20480784

申请日：1984-09-29

Applicant: Toshiba Corp

Inventor： KIKUCHI NORIMI ,  HAMAMURA KIYOTO

IPC: H05K3/12 ,  H05K3/18 ,  H05K3/24

公开(公告)号：JPS5934534A

公开(公告)日：1984-02-24

申请号：JP14541782

申请日：1982-08-23

Applicant: Toshiba Corp

Inventor： HAMAMURA KIYOTO

IPC: G03C1/74 ,  C23F1/00 ,  G03F7/16 ,  H01L21/027

CPC classification number: G03F7/162

Abstract: PURPOSE:To form the raised part of a photoresist film only on one side edge, and to form a pattern almost as indicated by the design, by carrying out spin coating in such a manner as placing substrates coated with a material to be etched on positions apart from the center of a rotation axis and fixing them. CONSTITUTION:The rectangular ceramic substrate 21 is coated with the material 22 to be etched made of a metal of a prescribed thickness by vapor deposition or the like, and these two substrates 21 are placed on a rotary table 24 apart from its rotation axis, e.g., by 1/2 of the thickness of the substrate 21 so as to give side edges. Then, they are coated with a photoresist soln. on the whole surface by dropping it and spinning the table 24, and dried by the ordinary drying method to form a photoresist film 26. After prebaking it, it is exposed, posi-baked after development, and the material 22 is etched using the post-baked film 26 as a mask to form a prescribed pattern. The film 26 is stripped to complete a thermosensitive printing head.

Abstract translation: 目的：仅在一个侧边缘上形成光致抗蚀剂膜的凸起部分，并且形成几乎如设计所示的图案，通过以如下方式进行旋涂，即将涂覆待蚀刻材料的基材放置在位置上 除了旋转轴的中心并固定它们。 构成：通过气相沉积等将矩形陶瓷基板21涂覆有要被预定厚度的金属制成的材料22，并将这两个基板21放置在离其旋转轴线的旋转台24上，例如 ，以基板21的厚度的1/2为边缘。 然后，用光致抗蚀剂溶胶涂布。 在整个表面上通过滴下并旋转工作台24，并通过常规干燥方法干燥以形成光致抗蚀剂膜26.在预烘烤之后，其在显影后曝光，喷涂，并且使用柱子蚀刻材料22 以薄膜26为掩模形成规定的图案。 剥离薄膜26以完成热敏打印头。

公开(公告)号：JPH0274041A

公开(公告)日：1990-03-14

申请号：JP22598288

申请日：1988-09-09

Applicant: TOSHIBA CORP

Inventor： HAMAMURA KIYOTO

IPC: H01L21/60 ,  H01L21/321

Abstract: PURPOSE:To make it possible to form highly reliable electrodes, which do not cause a short-circuit at the time of thermocompression bonding, by a method wherein a conductive paste is applied on the electrode parts in an area of 1/2 or smaller of the areas of the electrode parts by screen printing and when a screen printing plate is pulled apart, the conductive paste coating the electrode parts is conically formed due to the viscosity of the paste. CONSTITUTION:A screen printing plate 12 with apertures 11 to correspond to electrode parts 2 of an electronic component 10 is adhered closely to an electrode part formation surface of the component 10, a conductive paste layer 13 is applied on the parts 2 in an area of 1/2 or smaller of the areas of the parts 2 by screen printing and when the plate 12 is pulled apart, the paste layer 13 coating the parts 2 is conically formed due to the viscosity of the paste layer 13. Thereby, a short-circuit due to the spread of the paste layer at the time of thermocompression bonding is prevented and a highly reliable connection is obtained.

公开(公告)号：JPH0254945A

公开(公告)日：1990-02-23

申请号：JP20597388

申请日：1988-08-19

Applicant: TOSHIBA CORP

Inventor： HAMAMURA KIYOTO

IPC: H01G4/12 ,  H01C1/034 ,  H01F27/29 ,  H01G2/06 ,  H01G4/252 ,  H01L21/60 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34

Abstract: PURPOSE:To carry out electrical connection and fixing of each contact electrode simultaneously and to reduce packaging process by providing a plurality of contact electrodes which protrude from one surface on an electronic part body and a thermoplastic insulating contact layer which is formed on one surface whereon each contact electrode of the part body is formed. CONSTITUTION:A passivation films 21, 21... and an aluminum electrode 22 are formed on one surface of a silicon chip 20 by an IC chip, etc. A contact electrode 23 is formed on an upper section of each electrode 22. An insulating contact layer 24 having characteristics of B stage type is formed on one surface of the chip 20 in a thickness approximately equivalent to a height of each electrode 23. The contact electrode 23 formed on the upper section of the electrode 22 is formed by applying conductive adhesive consisting of thermosetting resin such as epoxy containing silver particles through screen print, and then dryed at a specified temperature for a specified time.

公开(公告)号：JPH01170029A

公开(公告)日：1989-07-05

申请号：JP32877587

申请日：1987-12-25

Applicant: TOSHIBA CORP

Inventor： HAMAMURA KIYOTO

IPC: H01L21/60 ,  H05K3/32 ,  H05K3/34

Abstract: PURPOSE:To assure the electric contact simultaneously preventing a semiconductor element from damaging by a method wherein the electrode surfaces and non-electrode surfaces are coated with insular conductive pastes almost flush with one another. CONSTITUTION:Electrodes 12 and non-electrode surfaces of a semiconductor element 11 are insularly screen-printed with conductive pastes 19 while the semiconductor element 11 with the conductive pastes 19 aligned with the specified positions on a wiring circuit substrate 13 is pressurized to cure the conductive pastes 19. In other words, the electrodes surfaces and the non-electrode surfaces of the semiconductor element 11 are coated with the insular conductive pastes 19 almost flush with one another so that the pushing pressure in case of pressurizing the semiconductor element 11 on the wiring circuit substrate 13 to be brought into contact with each other may be given evenly to overall element. Through these procedures, the electric contact can be assured while eliminating the local pressurization on the semiconductor element 11 thereby preventing the element 11 from damaging.

公开(公告)号：JPS6483683A

公开(公告)日：1989-03-29

申请号：JP24141787

申请日：1987-09-25

Applicant: TOSHIBA CORP

Inventor： YOSHINAGA SHINJI ,  HAMAMURA KIYOTO

IPC: C25D1/02

Abstract: PURPOSE:To obtain the title cylindrical parts free of strains, etc., by using the thermal stress generating mold-releasing jig consisting of plural members having different thermal expansion coefficients to release the electrocast mold from the electrodeposited metal. CONSTITUTION:A part of the electrocast mold 3 is masked 5. The electrocast mold 3 is plated with >=one kind among nickel, copper, gold, etc., in an electroplating bath. The thermal stress generating mold-releasing jig consisting of the members such as a fixing screw 2 and a base 1 having different thermal expansion coefficients is fixed to the plated electrocast mold 3. The mold 3 and the jig are simultaneously heated, and released from each other by utilizing the difference in the thermal expansion coefficients.