公开(公告)号：JPH06163739A

公开(公告)日：1994-06-10

申请号：JP30692392

申请日：1992-11-17

Applicant: TOSHIBA CORP

Inventor： YANO KEIICHI ,  ENDO MITSUYOSHI ,  KIKUCHI NORIMI ,  SATOU YOSHITOSHI

IPC: H01L23/52 ,  H01L21/3205 ,  H01L23/08 ,  H01L23/12 ,  H05K3/46

Abstract: PURPOSE:To provide a small semiconductor package that can realize correspondence to the increase in input/output signals and high heat radiation and prevent mulfunctions due to high-speed operation of a semiconductor chip. CONSTITUTION:A semiconductor package 1 is provided with a semiconductor chip 3 mounted therein, a multilayered aluminum nitride substrate 2 having wiring patterns (6, 7, 10, 11, 14, 15) connected electrically with the chip 3, and connecting terminals 4 that are electrically connected with the wiring patterns and are prepared on the opposite face to the chip mounting face of the substrate 2. At least one layer of the substrate 2 occupies a power source layer 13 or a ground layer 9 exclusively.

公开(公告)号：JPH0677345A

公开(公告)日：1994-03-18

申请号：JP22983292

申请日：1992-08-28

Applicant: TOSHIBA CORP

Inventor： KIKUCHI NORIMI

IPC: B28B11/02 ,  H01L23/08 ,  H01L23/12 ,  H05K1/03 ,  H05K3/12 ,  H05K3/46

Abstract: PURPOSE:To provide the manufacture of a ceramic circuit board, which stabilizes and shortens the manufacture process of a ceramic circuit board and improves the yield rate in manufacture. CONSTITUTION:This manufacture has a process 102 of performing desired die- cutting for a ceramic green sheet, a process of printing conductive paste on the ceramic green sheet into the shape of a desired circuit, a process 106 of baking the ceramic green sheet as a single layer or a laminate, and a process of inspecting the ceramic substrate after baking, and these several processes are performed in every lot. Before executing the manufacture process, only the process related to the green sheet itself is executed beforehand for specified quantity in every lot of the ceramic green sheet, and each manufacture process is executed in the unit of lot, based on the inspection result, etc.

公开(公告)号：JPH054213A

公开(公告)日：1993-01-14

申请号：JP15712091

申请日：1991-06-27

Applicant: TOSHIBA CORP ,  TOSHIBA MATERIAL ENG KK

Inventor： KIKUCHI NORIMI ,  MONMA JUN ,  KAWAMURA HIROYUKI ,  NAGAI HIROAKI

IPC: B28B11/04 ,  H01L21/50

Abstract: PURPOSE:To reduce the production of an inferior product, in the plating of ceramics package, by easily and efficiently forming a plating layer to the surface of the ceramics package wherein the formation of an outgoing line for electroplating from a planning aspect. CONSTITUTION:In the plating of a ceramics package 1a applying electroplating to a large number of the execution parts to be plated of the electrode pads 2 or connection pins 6 formed to the surface part of the ceramics packages 1a, a continuity jig 8 forming an electrical continuity state between the mutual execution parts to be plated is mounted on the package 1a to apply electroplating to the respective execution parts to be plated at the same time.

公开(公告)号：JPH04184964A

公开(公告)日：1992-07-01

申请号：JP31488190

申请日：1990-11-20

Applicant: TOSHIBA CORP ,  TOSHIBA MATERIAL ENG KK

Inventor： KIKUCHI NORIMI ,  KAWAMURA HIROYUKI

IPC: H01L23/373

Abstract: PURPOSE:To obtain a package, which is superior in heat diffusion effect, at low cost by a method wherein a heat sink is formed of a clad material obtainable by jointing a copper plate, a molybdenum plate or a tungsten plate and a copper plate. CONSTITUTION:A heat sink 7 is formed of a clad material obtainable by jointing a copper plate 7a, a molybdenum plate or a tungsten plate 7b and a copper plate 7c in the order of the plates 7a, 7b and 7c. The heat sink 7 obtainable by jointing these thin plates using a metal mold is jointed on a rear 1b of a ceramic substrate 1 consisting of aluminium nitride. Moreover, a screw 9 for screwing a heat dissipation fin on a package is jointed on the heat sink 7 via a copper pad 8 using a silver solder or the like. Thereby, the thermal expansions of the copper plates of the heat sink 7 are relaxed by the molybdenum plate or the tungsten plate arranged in the interior of the clad material, the joint property of the heat sink 7 to the package main body is increased and the package, which is superior in heat dissipation effect, is obtained at low cost.

公开(公告)号：JPH03250688A

公开(公告)日：1991-11-08

申请号：JP4551990

申请日：1990-02-28

Applicant: TOSHIBA CORP ,  TOSHIBA MATERIAL ENG KK

Inventor： KIKUCHI NORIMI ,  OKAMOTO MITSUHIRO ,  KAWAMURA HIROYUKI

IPC: C04B41/88 ,  H05K1/03 ,  H05K3/38

Abstract: PURPOSE:To form with ease a uniform alumina film on the surface of a nitrided aluminum substrate by performing an oxidation processing by making higher the pressure of oxidizing atmosphere gas in a processing furnace than the atmospheric pressure. CONSTITUTION:Upon an oxidization processing an aluminum nitride substrate 1 is set in a furnace body 12 from a delivery port provided in the furnace body 12 of a processing furnace 11, and air is fed into the furnace body 12 through a supply pipe 14 by pressurizing the air by a pressurization pump 15, and further the aluminum nitride substrate 1 is heated by an electrical heater 13. The nitrided aluminum substrate 1 is sufficiently struck by oxidized atmospheric gas by opposing a surface to be oxidized to the flow of the oxidizing atmosphere gas. The oxidizing atmosphere in the furnace body 12 is discharged through a discharge pipe 17 by activation of a suction pump 18. Hereby, an aluminum film having a uniform thickness can be formed on the surface of the aluminum nitride substrate 1.

公开(公告)号：JPH03108506A

公开(公告)日：1991-05-08

申请号：JP24525589

申请日：1989-09-22

Applicant: TOSHIBA CORP ,  TOSHIBA MATERIAL ENG KK

Inventor： KIKUCHI NORIMI ,  KAWAMURA HIROYUKI ,  OSOGUCHI HIROHISA

IPC: B28B11/00 ,  B28B11/12 ,  H05K3/00

Abstract: PURPOSE:To accurately hold a calcined sheet and to form a high-precision wiring by constituting the title distribution substrate so that a rectangular positioning part has a side part extended to the outside by estimating the shrinkage amount due to calcination for the side part of the rectangular positioning part formed on the calcined sheet. CONSTITUTION:A plurality of sheets of green sheet 1 are laminated at prescribed thickness. A plurality of pieces of rectangular holes 3 are arranged on the boundaries of the respective base bodies 2, punched and formed. These rectangular holes 3 are formed by sticking a rectangular pin to a press and punching the green sheet 1 and formed into a regular tetragon. The respective sides of the rectangular hole 3 are extended to the outsides while holding the extended amount estimating the shrinkage amount due to calcination of the green sheet for the respective sides of a rectangular hole 3A having size and dimension necessary to coincidently engage the positioning pin of a positioning jig. Thereby the base bodies 2 are accurately positioned and held. A wiring can be formed at high precision.

公开(公告)号：JPH0369188A

公开(公告)日：1991-03-25

申请号：JP20376689

申请日：1989-08-08

Applicant: TOSHIBA CORP

Inventor： KIKUCHI NORIMI

IPC: H05K3/40 ,  H01L23/12

Abstract: PURPOSE:To reduce generation ratio of defective products and improve yield and reduce cost by drying the exposed surface of a conductor paste which fills through-hole without causing it to contact other members. CONSTITUTION:A grid-shaped frame plate 2 is placed on a lower plate 1 and a ceramic green sheet 3 is placed on the window frame part of this frame plate 2. In this case through-holes 4 are provided so that it does not contact the window frame part of the frame plate. After this, the ceramic green sheet is subjected to heat treatment in a drying furnace in this state so that a conductor paste fills the through-hole 4 can be dried.

公开(公告)号：JPS623066A

公开(公告)日：1987-01-09

申请号：JP14117785

申请日：1985-06-27

Applicant: TOSHIBA CORP

Inventor： KIKUCHI NORIMI ,  EGAMI HARUTOSHI ,  ICHIMORI EIKICHI ,  YANAGISAWA TOSHIRO

IPC: C04B35/111 ,  C04B35/10

公开(公告)号：JPS61287480A

公开(公告)日：1986-12-17

申请号：JP12876985

申请日：1985-06-13

Applicant: TOSHIBA CORP

Inventor： KIKUCHI NORIMI

IPC: B05D7/22 ,  B05D1/42 ,  B41F17/14 ,  B41M1/40 ,  B41M3/00

Abstract: PURPOSE:To enable printing on the internal peripheral surface of a cylinder with uniform thickness of ink film by coating an internal peripheral surface of a cylinder temporarily with ink, inserting an exhausting jig provided with a gas ejection hole into the cylinder taking care not to contact with the temporarily coated ink and moving the jig in the cylinder while ejecting gas from the gas ejection hole. CONSTITUTION:After coating temporarily a desired amt. of ink 2 previously on the internal peripheral surface of a cylinder 1, an exhausting jig 3 having a gas ejection hole 4 is inserted into the cylinder taking care not to contact with the temporarily coated ink. The jig 3 is moved relatively to the cylinder 1 while ejecting gas from the ejection hole 4. As the result, printing of ink on the internal peripheral surface of the cylinder is attained with a uniform thickness without generating pinholes, etc.

公开(公告)号：JPH06163740A

公开(公告)日：1994-06-10

申请号：JP30692492

申请日：1992-11-17

Applicant: TOSHIBA CORP

Inventor： YANO KEIICHI ,  YAMAKAWA KOJI ,  ENDO MITSUYOSHI ,  KIKUCHI NORIMI ,  SATOU YOSHITOSHI

IPC: H01L23/12

Abstract: PURPOSE:To provide a semiconductor package that can be made compact and can suppress signal delay by shortening the internal wiring length through correspondence to the increase in input/output signals or high heat radiation. CONSTITUTION:A semiconductor package 1 is provided with a semiconductor chip 3 mounted therein, a multilayered aluminum nitride substrate 2 having wiring patterns connected electrically with the chip 3, and connecting terminals 4 that are electrically connected with the wiring patterns and are prepared on the opposite face to the chip mounting face of the substrate 2. A signal wiring layer 8 and a ground layer 9 or a power source layer 12 coexist in at least one layer of the substrate 2.