Abstract:
PROBLEM TO BE SOLVED: To provide a method for forming a metal-backed phosphor screen, capable of preventing an electron emitter and a phosphor screen from being damaged or deteriorated due to electric discharge. SOLUTION: The method for forming metal-backed phosphor screen comprises forming a layer (dissolution or oxidation layer) containing a material for dissolution or oxidation a metal layer in a predetermined area on the phosphor screen, and then forming a metal layer thereon. By performing heating process such as baking, the metal layer located directly over the dissolution or oxidation layer is dissolved and eliminated, or converted into an oxidant with high electricity resistance, thus achieving a metal-backed layer electrically segmented into a predetermined pattern. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an image display device like an FED (field emission display) prevented from breakage and deterioration of an electron emitting element or a fluorescent surface by improving the dielectric strength, attaining a display with high brightness and high quality. SOLUTION: The fluorescent surface of the image display device has a light absorbing layer and a phosphor layer, a metal back layer formed on the phosphor layer having a dividing part, a covering layer with high resistance formed on the dividing part of the metal back layer so as to stride over the metal back layers at both sides, a heat resistant fine particle layer formed on the covering layer, and a getter layer formed on the metal back layer divided by the heat resistant fine particle layer. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To reduce the generation or discharge of gas from a fluorescent screen and prolong a service life of an electron source in a fluorescent screen with a metal back of an image display device such as an FED. SOLUTION: In the fluorescent screen with the metal back having an optical absorbing layer and a phosphor layer on a face plate inner surface, and having a metal back layer on the phosphor layer, a light absorbing layer includes an oxygen supplying agent in which a reducing metal is added to a metal oxide. The particle diameter of the oxygen supplying agent is preferably 1-10 μm. A phosphor material in which an activator such as Eu is added to a phosphor base containing oxygen such as Y 2 O 2 S may be used as the oxygen supplying agent. COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To enable an image display device to have display of high brightness and high definition through restraint of discharge generated between substrates, and reduction of cases of destruction of electron sources and a phosphor screen as well as of deterioration of light-emitting characteristics. SOLUTION: The image display device has a smoothing layer 36 stably and firmly fixing phosphor layers 32, 33, 34 on a second substrate 3 and smoothing their surfaces, a metal back layer 37 reflecting light output by the phosphor layers toward a given direction of the second substrate, and a material 38 denaturing the metal back layer into electrically discontinuous characteristics at each specific area connected with the number or an alignment of electron beam sources fitted to the first substrate 2. The material 38 is integrated with the metal back layer 37 at a prescribed temperature. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an image display device suppressing the peak value of a discharge current even if discharge is caused between an electron source side and a fluorescent surface side while having high productivity, and also to provide its manufacturing method. SOLUTION: In an FED 1 of this invention, a light shielding wall 35 to partition the phosphor layers 32, 33, 34 of the fluorescent surface 31 has recessed and projecting parts providing a discontinuous region in which at least electric resistance becomes larger than a prescribed size for a metal layer 36 for a metal back layer and a metal layer 37 for a getter layer, at its end part on the side which is not in contact with a glass substrate 30 for supporting the fluorescent surface. The height of the light shielding layer, that is, its thickness is equal to the thickness of the sum of the thickness of a phosphor region, the thickness of the metal layer, and the thickness of a gas adsorbing layer, or is defined to a prescribed height as opposed to the height of a second substrate, in at least a part of the region of the second substrate in its surface direction. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To improve a withstand voltage characteristic by preventing the occurence of discharge in a fluorescent screen with a metal back of an image display device such as an FED. SOLUTION: A covering layer including low melting point glass is arranged in an end part of a metal back layer. A projecting part of a metal back layer end part becoming a factor in generating the discharge is wrapped and covered with this covering layer. This fluorescent screen with the metal back has the metal back layer divided into blocks. The covering layer including a heat resistant inorganic particulate and the low melting point glass is straddlingly arranged in both side metal back layer end parts on a divided part of the metal back layer. The occurence of discharge is restrained. The withstand voltage characteristic can be further improved by controlling a sheet resistance value of this covering layer. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide an antistatic film which reduces the dependency of the resistance on the film thickness and the environment and can be formed by a simple coating method. SOLUTION: The antistatic film can be obtained by coating a dispersion mainly containing high resistance fine particles having a resistivity of 106 to 109 Ω.cm by a simple method such as spray coating and brushing, and firing the resulting film. As the high resistance fine particles, fine particles having a core layer of antimony pentoxide (Sb2O5) having a pyrochlore crystal structure or at least one semiconducting substance to be selected from SnO2, In2O3, Sb2O5, and ZnO2 and a covering layer of at least one insulating substance to be selected from SiO2, TiO2, Al2O3, and ZrO2.
Abstract:
PROBLEM TO BE SOLVED: To suppress magnitude of discharge current of an electric discharge generated between substrates to reduce destruction of an electron source or a fluorescent face, and deterioration of a light emission characteristic, in an image display device. SOLUTION: In this image display device, a main portion of a light shielding part 35 sectionalizing phosphor layers 32, 33, 34 of a fluorescent face 31 has a recessed part 35c capable of imparting a prescribed resistance value such that it can deter the magnitude of the discharge current even if the electric discharge is generated from a metal back layer 37, and improving a withstanding voltage to discharge voltage that is a factor generating the electric discharge. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To suppress magnitude of discharge current of an electric discharge generated between substrates to reduce destruction of an electron source or a fluorescent face, and deterioration of a light emission characteristic, in an image display device. SOLUTION: Because an end part of a metal back layer 37 (and a getter layer 38) of this image display device 1 is deformed to a glass substrate 30 side, a discharge start voltage when the electric discharge is generated is increased (a discharge withstanding voltage is improved). COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a fluorescent screen with metal back of a picture display device such as an FED with increased adhesiveness of a metal back layer and a phosphor layer as a lower layer and improved pressure withstanding property. SOLUTION: On the screen with a metal back, a coating layer, having a heat-resistant particulate such as SiO 2 , Al 2 O 3 as main components, is formed on a metal back layer, and when the average thickness of a light absorption layer is made a and the average thickness of the phosphor layer is made b, thickness of each layer is adjusted so that the formula -5μm