公开(公告)号：WO2007033146A3

公开(公告)日：2007-03-22

申请号：PCT/US2006/035442

申请日：2006-09-13

Applicant: TOUCHDOWN TECHNOLOGIES, INC.

Inventor： GARABEDIAN, Raffi ,  TEA, Nim, Hak ,  ISMAIL, Saleh

IPC: G01R1/073 ,  H01R13/24

Abstract: An interposer has an interposer substrate (100) with an upper surface and a lower surface and at least one resilient contact element having an upper portion (110A) and a lower portion (HOB). The upper portion extends in a substantially vertical fashion above the upper surface of the interposer substrate, and the lower portion extends in a substantially vertical fashion below the lower surface of the interposer substrate. The upper and lower portions of the resilient contact element are substantially resilient in a direction parallel to the substrate.