公开(公告)号：US09713254B2

公开(公告)日：2017-07-18

申请号：US14873567

申请日：2015-10-02

Applicant: TPK HOLDING CO., LTD.

Inventor： Michael Eugene Young ,  Arjun Daniel Srinivas ,  Matthew R. Robinson ,  Alexander Chow Mittal

IPC: H01L33/00 ,  H01L31/00 ,  H01B1/06 ,  H01M4/02 ,  H05K1/09 ,  H01L31/048 ,  H01L31/055 ,  H01L31/0216 ,  H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H01L31/05

CPC classification number: H05K1/09 ,  H01L31/02167 ,  H01L31/0481 ,  H01L31/05 ,  H01L31/055 ,  H05K1/0274 ,  H05K1/0313 ,  H05K1/115 ,  H05K2201/0302 ,  H05K2201/0326 ,  H05K2201/0364 ,  H05K2201/10977 ,  Y02E10/52 ,  Y02E10/54 ,  Y02E10/542

Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.