公开(公告)号：US12256136B2

公开(公告)日：2025-03-18

申请号：US17980415

申请日：2022-11-03

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.

Inventor： Ding-Nan Huang ,  Ke-Hua Fan ,  Kun Li ,  Jing Guo ,  Han-Ru Zhang

IPC: H04N23/57 ,  G02B7/10 ,  H04N23/54 ,  H04N23/55 ,  H05K1/18

Abstract: A camera module includes a circuit board, a lens assembly, and a first board. The circuit board includes a first surface, a second surface opposite to the first surface, a first sidewall, and a second sidewall opposite to the first sidewall. Each of the first sidewall and the second sidewall connects the first surface to the second surface. The lens assembly is disposed on the first surface. The first board is connected to the first sidewall. The first board is inclined or perpendicular to the first surface. The first board is disposed on a side of the lens assembly.