公开(公告)号：EP0229503A3

公开(公告)日：1988-04-27

申请号：EP86309758

申请日：1986-12-15

Applicant: TRW INC.

Inventor： Damerow, Milton Frank ,  Kocin, Michael Joseph

IPC: H05K01/14 ,  H05K01/00 ,  H05K03/36

CPC classification number: H01R12/722 ,  H01R12/73 ,  H01R12/79 ,  H01R12/91 ,  H05K1/144 ,  H05K2201/044

Abstract: A dual printed circuit board module having two printed circuit boards mounted in an inwardly facing relationship on two thermal frame members that also function as structural and enclosing members. A connector mounted between and at one edge of the thermal frame members serves to establish electrical connections between the circuit boards and a backplane circuit panel to which the boards are to be connected. A flexible interconnect circuit, located near the same edge of the boards as the backplane connector, is used both to connect the boards to the connector and to provide board- to-board connections independently of the connector. This arrangement greatly facilitates assembly and testing of the module, reduces signal path lengths, and enhances the structural and thermal integrity of the module.

公开(公告)号：EP0229503B1

公开(公告)日：1991-03-06

申请号：EP86309758.0

申请日：1986-12-15

Applicant: TRW INC.

Inventor： Damerow, Milton Frank ,  Kocin, Michael Joseph

IPC: H05K1/14 ,  H05K1/00 ,  H05K3/36

CPC classification number: H01R12/722 ,  H01R12/73 ,  H01R12/79 ,  H01R12/91 ,  H05K1/144 ,  H05K2201/044

公开(公告)号：EP0229503A2

公开(公告)日：1987-07-22

申请号：EP86309758.0

申请日：1986-12-15

Applicant: TRW INC.

Inventor： Damerow, Milton Frank ,  Kocin, Michael Joseph

IPC: H05K1/14 ,  H05K1/00 ,  H05K3/36

CPC classification number: H01R12/722 ,  H01R12/73 ,  H01R12/79 ,  H01R12/91 ,  H05K1/144 ,  H05K2201/044

Abstract: A dual printed circuit board module having two printed circuit boards mounted in an inwardly facing relationship on two thermal frame members that also function as structural and enclosing members. A connector mounted between and at one edge of the thermal frame members serves to establish electrical connections between the circuit boards and a backplane circuit panel to which the boards are to be connected. A flexible interconnect circuit, located near the same edge of the boards as the backplane connector, is used both to connect the boards to the connector and to provide board- to-board connections independently of the connector. This arrangement greatly facilitates assembly and testing of the module, reduces signal path lengths, and enhances the structural and thermal integrity of the module.