公开(公告)号：EP3054752A1

公开(公告)日：2016-08-10

申请号：EP14849338.0

申请日：2014-09-30

Applicant: Taiyo Ink Mfg. Co., Ltd.

Inventor： SHIMURA Masayuki ,  FURUTA Yoshiyuki ,  YUMOTO Masao

IPC: H05K3/28 ,  B41M5/00 ,  C08F2/48 ,  C09D4/02 ,  C09D11/30

Abstract: Provided are: a curable composition that has excellent flexibility and shows excellent adhesion to both a plastic substrate and a conductor layer; a coating film of the curable composition; and a printed circuit board comprising a pattern-cured coating film obtained from the coating film. The present invention relates to: a curable composition for a printed circuit board, which is characterized by comprising (A) a block copolymer, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator; a coating film obtained by photo-curing the curable composition; and a printed circuit board comprising a resist pattern formed from the coating film.

公开(公告)号：EP3054752B1

公开(公告)日：2019-10-30

申请号：EP14849338.0

申请日：2014-09-30

Applicant: Taiyo Ink Mfg. Co., Ltd.

Inventor： SHIMURA Masayuki ,  FURUTA Yoshiyuki ,  YUMOTO Masao

IPC: H05K3/28 ,  B41M5/00 ,  C08F2/48 ,  C09D4/02 ,  C09D11/30 ,  C09D11/10 ,  C09D11/101 ,  C09D4/06 ,  C08F220/10 ,  C09D133/06

公开(公告)号：EP3067371B1

公开(公告)日：2020-02-12

申请号：EP14860632.0

申请日：2014-09-30

Applicant: Taiyo Ink Mfg. Co., Ltd.

Inventor： SHIMURA Masayuki ,  FURUTA Yoshiyuki ,  YUMOTO Masao

IPC: C08F2/44 ,  B41M5/00 ,  C08F2/48 ,  C09D4/02 ,  C09D11/00 ,  H05K3/28

公开(公告)号：EP3067374A1

公开(公告)日：2016-09-14

申请号：EP14859821.2

申请日：2014-11-04

Applicant: Taiyo Ink Mfg. Co., Ltd.

Inventor： SHIMURA Masayuki ,  FURUTA Yoshiyuki ,  YUMOTO Masao

IPC: C08F20/10 ,  C08F8/14 ,  H05K3/28

CPC classification number: C09D4/00 ,  C08F8/14 ,  C08F220/06 ,  C08F220/32 ,  C09D11/101 ,  C09D11/30 ,  C09D133/14 ,  C09D201/08 ,  G03F7/00 ,  G03F7/004 ,  H05K1/0313 ,  H05K3/0023 ,  H05K3/064 ,  H05K3/287 ,  H05K2203/0759

Abstract: Provided are: a curable composition that shows good adhesion on a printed wiring board, particularly a flexible substrate or the like, and has a high hardness; a resist coating film of the curable composition; and a printed wiring board having a resist pattern of the resist coating film. The curable composition comprises: (A) a photobase generator; (B-1) an epoxy group-containing (meth)acrylate compound or (B-2) a carboxyl group-containing (meth)acrylate compound; (C) a photopolymerization initiator; and (D-1) a thermosetting component (excluding the (B-1) epoxy group-containing (meth)acrylate compound) or (D-2) a thermosetting component (excluding the (B-2) carboxyl group-containing (meth)acrylate compound).

Abstract translation: 提供：在印刷线路板，特别是柔性基板等上显示出良好的粘附性并且具有高硬度的可固化组合物; 可固化组合物的抗蚀剂涂膜; 以及具有抗蚀剂涂膜的抗蚀剂图案的印刷线路板。 可固化组合物包含：（A）光碱产生剂; （B-1）含环氧基的（甲基）丙烯酸酯化合物或（B-2）含羧基的（甲基）丙烯酸酯化合物; （C）光聚合引发剂; 和（D-1）热固性组分（不包括（B-1）含环氧基的（甲基）丙烯酸酯化合物）或（D-2）热固性组分（不包括（B-2） ）丙烯酸酯化合物）。

公开(公告)号：EP3067371A1

公开(公告)日：2016-09-14

申请号：EP14860632.0

申请日：2014-09-30

Applicant: Taiyo Ink Mfg. Co., Ltd.

Inventor： SHIMURA Masayuki ,  FURUTA Yoshiyuki ,  YUMOTO Masao

IPC: C08F2/44 ,  B41M5/00 ,  C08F2/48 ,  C09D4/02 ,  C09D7/12 ,  C09D11/00 ,  H05K3/28

Abstract: Provided is a curable composition for a printed wiring board, which composition exhibits high physical strength as a coating film in terms of solder heat resistance, pencil hardness and the like and in which the components contained therein are not likely to precipitate in long-term storage even when the composition is configured to have a low viscosity and thereby made applicable to ink-jet printing, spin-coating and the like. The curable composition for a printed wiring board is characterized by comprising (A) a filler having a specific gravity of 3 or less, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator. The (A) filler having a specific gravity of 3 or less is preferably an inorganic filler.

Abstract translation: 本发明提供一种印刷配线板，该组合物表现出高的物理强度的涂层的固化性组合物膜在其中焊料耐热性，铅笔硬度等的和术语其中所含的组分不可能在长期储存中以沉淀 甚至当所述组合物被配置为具有低粘度，从而使其适用于喷墨印刷，旋涂等。 用于印刷电路板用的可固化组合物通过包括（A）具有3或更小的比重的填料，（B）含羟基的（甲基）丙烯酸酯化合物和（C）光聚合引发剂为特征的。 具有3或更小的比重的（A）的填料是优选的无机填料。