公开(公告)号：US20240428393A1

公开(公告)日：2024-12-26

申请号：US18736759

申请日：2024-06-07

Applicant: Taiyuan University of Science and Technology

Inventor： Anhong WANG ,  Hao JING ,  Zishan TANG ,  Peihao LI ,  Jiapeng JIA

IPC: G06T7/00 ,  G06F30/392 ,  G06T7/11 ,  G06T7/12 ,  G06T7/136

Abstract: Disclosed is a cutting path planning algorithm for semiconductor workpiece based on image processing, belonging to the technical field of image calculation, and solving the technical problem of manually cutting off the heterocrystal region on the wafer, which includes the following steps: 1, obtaining a semantic boundary of an image; 2, finding a largest inscribed rectangle MRect in the single crystal image X1; 3. dividing the contour region in the single crystal region to find the corresponding cutting line; 4. determining the final cutting line. The cutting line planned by the application may realize automatic cutting of the wafer, and may better reserve the required single crystal region.