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公开(公告)号：JP2007059752A
公开(公告)日：2007-03-08
申请号：JP2005245422
申请日：2005-08-26
Inventor： YASUDA MASATOSHI , KUDO SHIN
Abstract: PROBLEM TO BE SOLVED: To provide a common mode filter provided with high joining strength by electrically joining electrodes of flange portions to an electrode pattern of a circuit board using a conductive paste. SOLUTION: Electrode 40 are not provided but exposed portions 11F exposing the foundations of the flange portions 11, 11 of a drum core 10 are provided on mounting surfaces 11C of the flange portions 11, 11 of the common mode filter 1. The exposed regions 11F are each provided along the opening edge portion of a groove 11c from one end to the other end in the extending direction of the groove 11c, and in an end edge portion of a winding core 12 side of the mounting surface 11C, the exposed regions 11F are provided to both ends of the flange portions 11, 11 in the horizontal direction of the common mode filter. The exposed regions 11F on the mounting surfaces 11C and the mounting sections 41 of the electrodes 40 are bonded on the electrode pattern of the circuit board via the conductive paste. COPYRIGHT: (C)2007,JPO&INPIT
Abstract translation: 要解决的问题：通过使用导电浆将凸缘部分的电极与电路板的电极图案电连接来提供具有高接合强度的共模滤波器。 解决方案：不设置电极40，而暴露出鼓芯10的凸缘部分11,11的基部的暴露部分11F设置在共模滤波器1的凸缘部分11,11的安装表面11C上。 露出区域11F分别沿着槽11c的延伸方向从一端到另一端沿槽11c的开口边缘部分设置，并且在安装表面11C的卷芯12侧的端边缘部分中， 露出区域11F在共模滤波器的水平方向上设置在凸缘部11,11的两端。 安装面11C上的露出区域11F和电极40的安装部分41通过导电膏接合在电路板的电极图案上。 版权所有（C）2007，JPO＆INPIT
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Patent Agency Ranking
公开(公告)号：JP2009238825A
公开(公告)日：2009-10-15
申请号：JP2008080038
申请日：2008-03-26
Inventor： YASUDA MASATOSHI , KUDO SHIN , SUZUKI HIROSHI , KOBAYASHI KAZUMI
IPC: H01F27/06
Abstract: PROBLEM TO BE SOLVED: To provide an electronic component and a mounting structure of the electronic component, for achieving excellent bonding by conductive paste while suppressing the enlargement of the electronic component.
SOLUTION: For a common mode filter, a flange part 11 of a drum core constituted of a magnetic body such as ferrite or a non-magnetic body such as ceramic is provided with an electrode 40. When fitting the electrode 40 which is a roughly U-shaped metal fitting to the flange part 11, a gap for the conductive paste P to be interposed between a facing surface 41B and a facing surface 11H is formed. When mounting the common mode filter on the electrode pattern 2A of a circuit board 2, the conductive paste P bonds the common mode filter 1 and the circuit board 2 in the state with both interposed integrally from the part between the exposed region 11F of a mounting surface and the mounting surface 41A of the electrode 40 to the part between the facing surface 41B of the electrode 40 and the facing surface 11H of the flange part 11.
COPYRIGHT: (C)2010,JPO&INPITAbstract translation: 要解决的问题：为了提供电子部件的电子部件和安装结构，用于在抑制电子部件的放大的同时通过导电膏实现优良的接合。 解决方案：对于共模滤波器，由诸如铁氧体的磁体或诸如陶瓷的非磁性体构成的鼓芯的凸缘部分11设置有电极40.当安装电极40时， 形成与凸缘部11相配合的大致U字形的金属，形成介于面对面41B与面对面11H之间的导电性糊剂P的间隙。 当将共模滤波器安装在电路板2的电极图案2A上时，导电浆料P在共模滤波器1和电路板2之间的状态下，两者都从安装件的暴露区域11F 表面和电极40的安装表面41A连接到电极40的相对表面41B与凸缘部分11的相对表面11H之间的部分。（C）2010，JPO＆INPIT
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公开(公告)号：JP2007005769A
公开(公告)日：2007-01-11
申请号：JP2006122359
申请日：2006-04-26
Inventor： YASUDA MASATOSHI , KUDO SHIN , SUZUKI HIROSHI , KOBAYASHI KAZUMI
CPC classification number: H01F17/045 , H01F27/027 , H01F27/292 , H01F27/38 , H01F2017/0093 , H05K3/321 , H05K2201/10628
Abstract: PROBLEM TO BE SOLVED: To provide coil parts whose influence on other parts is reduced, when mounting on a circuit board, and further the mounting strength to the circuit board is improved, and to provide an electronic apparatus.
SOLUTION: The electronic apparatus 1 comprises the coil component 2 which is mounted on the circuit board 3 with a conductive paste. The coil part 2 comprises a drum core 4, and the drum core 4 has flanges 8A and 8B provided to both ends of the core. Winding wires 9 and 10 are wound around the cores of the drum core 4. The flanges 8A and 8B have terminal-forming regions 12 on both end sides. Two terminal fittings 13 and 14, electrically connected to both ends of the winding wires 9 and 10, are fixed to each terminal forming region 12, respectively. A grooved recess 16, having rectangular cross-sectional surface which opens in a mounting surface, is provided to the lower end of a region between the terminal-forming regions 12 in the flanges 8A and 8B. Consequently, progress of metal dendrite deposition due to ion migration is suppressed, at voltage application.
COPYRIGHT: (C)2007,JPO&INPITAbstract translation: 要解决的问题：为了提供对其他部件的影响减小的线圈部件，当安装在电路板上时，进一步提高对电路板的安装强度，并提供电子设备。 解决方案：电子设备1包括用导电浆料安装在电路板3上的线圈部件2。 线圈部分2包括鼓芯4，并且鼓芯4具有设置在芯的两端的凸缘8A和8B。 卷绕线9和10缠绕在鼓芯4的芯上。凸缘8A和8B在两端具有端子形成区域12。 电连接到绕组线9和10的两端的两个端子配件13和14分别固定到每个端子形成区域12。 在凸缘8A和8B中的端子形成区域12之间的区域的下端设置有在安装表面上开口的具有矩形横截面的凹槽16。 因此，在施加电压时，由于离子迁移导致的金属枝晶沉积的进展被抑制。 版权所有（C）2007，JPO＆INPIT
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公开(公告)号：JP2009088065A
公开(公告)日：2009-04-23
申请号：JP2007253183
申请日：2007-09-28
Inventor： ARIMITSU ICHITO , SUZUKI HIROSHI , HATAKEYAMA YUTAKA , SASAKI HIDEKI , KUMAGAI MASARU , KUDO SHIN
Abstract: PROBLEM TO BE SOLVED: To provide an electronic component whose mounting strength can be enhanced by plating the end portion of an external terminal, and to provide a method of manufacturing the same.
SOLUTION: A metal portion 33A is arranged at a position 20b-3 lower than the main surface 20-1 by one step in a notch 20b. Although the metal portion 33A has a nearly rectangular parallelepiped shape and projects from a concave surface portion 20b-1 defining the notch, the projected length is smaller than the depth of the first step part 20b-3 of the concave surface portion 20b-1 with respect to the main surface 20-1, it is positioned more inwardly than the main surface 20-1 in the case 20. The metal portion 33A and a terminal electrode 30 are integrally formed, and the projected end face 33B of the metal portion 33A forms a cutting plane produced by cutting from a frame portion 3-1 in the manufacturing process of a coil component 1. The metal portion 33A is in a connectionless state wherein it is not mechanically and electrically directly connected to any conductor even after the coil component 1 has been mounted on a board.
COPYRIGHT: (C)2009,JPO&INPITAbstract translation: 要解决的问题：提供一种通过电镀外部端子的端部可以提高其安装强度并提供其制造方法的电子部件。 解决方案：金属部分33A在凹口20b中被布置在低于主表面20-1的位置20b-3处一级。 尽管金属部分33A具有近似长方体形状并且从限定凹口的凹面部分20b-1突出，但是突出长度小于凹面部分20b-1的第一台阶部分20b-3的深度， 相对于主表面20-1，其位于壳体20中比主表面20-1更靠内侧。金属部分33A和端子电极30一体形成，并且金属部分33A的突出端面33B 形成在线圈部件1的制造过程中从框架部分3-1切割而产生的切割平面。金属部分33A处于无连接状态，其中即使在线圈部件之后也不直接连接到任何导体 1已经安装在电路板上。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：DE102006024174A1
公开(公告)日：2007-04-05
申请号：DE102006024174
申请日：2006-05-23
Applicant: TDK CORP
Inventor： YASUDA MASATOSHI , KUDO SHIN , SUZUKI HIROSHI , KOBAYASHI KATSUMI
Abstract: A coil component comprises a core element having a mounting portion, a coil conductor placed on the core element, and at least two terminal electrodes which are placed in the mounting portion. The mounting portion has at least two terminal placement areas for placing the terminal electrodes respectively. A hollow portion opening to the mounting side face of the mounting portion is formed in an area between the at least two terminal placement areas in the mounting portion. When mounting the coil component on a circuit board, conductive paste is intervened between an area from the terminal electrodes placed in the mounting portion of the core element to the base exposed area of the mounting portion, and the electrode patterns on the circuit board.
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公开(公告)号：JP2006351953A
公开(公告)日：2006-12-28
申请号：JP2005178206
申请日：2005-06-17
Applicant: TDK CORP
Inventor： YASUDA MASATOSHI , KUDO SHIN
Abstract: PROBLEM TO BE SOLVED: To provide electronic equipment which can have an electronic component mounted on a circuit board with conductive paste to high strength without increasing the number of manufacturing processes. SOLUTION: The electronic equipment 1 is equipped with the circuit board 3 having a plurality of land patterns 2, and the coil component 4 mounted on the circuit board 3 with the conductive paste P. The coil component 4 has a drum core 5 which is provided with collars 8A and 8B and windings 9 and 10. The collars 8A and 8B have primary collar bodies 11, and electrode terminal metal fittings 13 and 14 which are electrically connected to the windings 9 and 10 are provided on both sides of the primary collar body 11, respectively. When the coil component 4 is mounted, the conductive paste P is applied over the entire reverse surfaces 13a and 14a of the electrode terminal metal fittings 13 and 14 and between end areas of the collars 8A and 8B which are adjacent to the electrode terminal metal fittings 13 and 14 on the reverse surface 11a of the primary color body 11 and the land patterns 2. COPYRIGHT: (C)2007,JPO&INPIT
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