公开(公告)号：US20220219232A1

公开(公告)日：2022-07-14

申请号：US17607736

申请日：2020-06-04

Applicant: FUKUDA METAL FOIL & POWDER CO.,LTD. ,  TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING

Inventor： Yuji SUGITANI ,  Hideki KYOGOKU

IPC: B22F1/12 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B22F1/05 ,  B22F10/28 ,  B23K26/342

Abstract: The present invention provides a laminating and shaping copper powder capable of shaping a laminated and shaped object of copper having a high electrical conductivity of, for example, 80% IACS or more. The present invention is a laminating and shaping copper powder obtained by mixing a nano-oxide of equal to or more than 0.01 wt % and equal to or less than 0.20 wt % and a pure copper powder. There is also provided a laminated and shaped object using the laminating and shaping copper powder of the present invention. There are also provided a manufacturing method of the laminated and shaped object using the laminating and shaping copper powder of the present invention and a laminating and shaping apparatus using the laminating and shaping copper powder.

公开(公告)号：US20200264086A1

公开(公告)日：2020-08-20

申请号：US16641983

申请日：2017-08-25

Applicant: FUKUDA METAL FOIL & POWDER CO., LTD. ,  TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING

Inventor： Seiichi MATSUMOTO ,  Yuji SUGITANI

IPC: G01N11/14 ,  B33Y30/00 ,  B33Y50/00 ,  B23K15/00 ,  B23K26/342

Abstract: This invention relates to a method of evaluating powder for lamination shaping by stable criteria. In this method, it is evaluated whether powder for lamination shaping can be spread into a uniform powder layer in the lamination shaping, wherein the powder is evaluated using, as a flowability of the powder, an adhesive force of the powder calculated from a failure envelope obtained by a shear test. The shear test is conducted by a powder rheometer, and the adhesive force is obtained from the relationship between a normal stress and a shearing stress at the powder rheometer. If the adhesive force is 0.450 kPa or less, the powder is evaluated to be spread into a uniform powder layer in the lamination shaping. Furthermore, if at least one of that the 50% particle sin of the powder obtained by a laser diffraction method is 3 to 250 μm and that the apparent density of the powder is 3.5 g/cm3 or more is satisfied, the powder is evaluated to be spread into a uniform powder layer in the lamination shaping.

公开(公告)号：US20200254517A1

公开(公告)日：2020-08-13

申请号：US16641963

申请日：2017-08-25

Applicant: FUKUDA METAL FOIL & POWDER CO., LTD. ,  TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING

Inventor： Seiichi MATSUMOTO ,  Yuji SUGITANI ,  Motonori NISHIDA

IPC: B22F1/00 ,  G01N3/24 ,  C22C1/04

Abstract: This invention relates to a method of evaluating a squeegeeing property of powder for lamination shaping by stable criteria. In this method, the squeegeeing property is evaluated using at least a satellite adhesion ratio of the powder and an apparent density of the powder. The satellite adhesion ratio is the ratio of the number of particles on which satellites are adhered to the number of all particles. If the satellite adhesion ratio is equal to or less than 50%, and the apparent density is equal to or more than 3.5 g/cm3, the squeegeeing property is evaluated as that the powder can be spread into a uniform powder layer in the lamination shaping. Furthermore, if the 50% particle size of a powder obtained by a laser diffraction method is 3 to 250 μm, the squeegeeing property is evaluated as that the powder can be spread into a uniform powder layer in the lamination shaping.

公开(公告)号：US20180333775A1

公开(公告)日：2018-11-22

申请号：US15545995

申请日：2016-12-26

Applicant: Technology Research Association For Future Additive Manufacturing

Inventor： Motonori NISHIDA ,  Yuji SUGITANI ,  Akihiko CHIBA ,  Youhei DAINO

IPC: B22F1/02 ,  B22F1/00 ,  B33Y70/00

CPC classification number: B22F1/025 ,  B22F1/00 ,  B22F1/0011 ,  B22F1/02 ,  B22F3/105 ,  B22F3/1055 ,  B22F3/16 ,  B22F2301/15 ,  B22F2304/10 ,  B33Y70/00

Abstract: The present invention relates to a metal powder which shortens a lamination-shaping time and facilitates the removal of an unnecessary powder after lamination-shaping by decreasing a pre-sintering temperature by using a processed metal powder. This metal powder for lamination-shaping is obtained by coating the surface of a powder of a nickel-based alloy with a conductive material. When the powder is the powder of the nickel-based alloy containing nickel as a main component and chromium and iron as primary subcomponents, the powder is coated, e.g., plated with nickel as the conductive material. The particle diameter range of the powder of the nickel-based alloy is 10 to 200 μm, preferably 25 to 150 μm, and more preferably 45 to 105 μm. The thickness range of the conductive material is 0.1 to 1 μm, and preferably 0.3 μm or more.

公开(公告)号：US20200180024A1

公开(公告)日：2020-06-11

申请号：US16625516

申请日：2017-06-21

Applicant: FUKUDA METAL FOIL & POWDER CO., LTD. ,  TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING

Inventor： Yuji SUGITANI ,  Yoshito NISHIZAWA ,  Takeshi MARUYAMA ,  Hiroaki OKUBO OKUBO

IPC: B22F3/105 ,  B33Y10/00

Abstract: In this invention, a copper powder to which phosphorus (P) is added is developed such that a high-density laminated and shaped product can be obtained by a laminating and shaping method using a fiber laser as a heat source by appropriately reducing the electrical conductivity of copper, so a laminated and shaped product having a high density and a high electrical conductivity can be obtained. This invention is a copper powder for lamination shaping in which a phosphorus element is added to pure copper. The copper powder desirably contains 0.01 wt % or more of the phosphorus element. The copper powder more desirably contains 0.04 wt % or more of the phosphorus element. The copper powder desirably contains 0.30 wt % or less of the phosphorus element. The copper powder more desirably contains 0.24 wt % or less of the phosphorus element. No element other than the phosphorus element is desirably added to the copper powder.

公开(公告)号：US20200147682A1

公开(公告)日：2020-05-14

申请号：US16631832

申请日：2017-07-18

Applicant: FUKUDA METAL FOIL & POWDER CO., LTD. ,  TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING

Inventor： Yuji SUGITANI ,  Yoshito NiSHIZAWA ,  Takeshi MARUYAMA ,  Hiroaki OKUBO

IPC: B22F1/00 ,  B22F3/105 ,  B33Y80/00

Abstract: This invention provides a copper powder to which tin (Sn) is added such that a high-density laminated and shaped product can be obtained by a laminating and shaping method using a fiber laser as a heat source by appropriately reducing the electrical conductivity of copper, so a laminated and shaped product having a high density and a high electrical conductivity can be obtained. That is, this invention provides a copper powder for lamination shaping in which a tin element is added to pure copper. Desirably, the copper powder contains 0.5 wt % or more of the tin element. More desirably, the copper powder contains 5.0 wt % or more of the tin element. When the product has an electrical conductivity sufficient as a copper product, the copper powder desirably contains 6.0 wt % or less of the tin element. Furthermore, no element other than the tin element is desirably added to the copper powder.