公开(公告)号：US20170084453A1

公开(公告)日：2017-03-23

申请号：US15369000

申请日：2016-12-05

Applicant: Texas Instruments Incorporated

Inventor： Sandra Zheng ,  Mark James Smiley ,  Douglas Jay Levack ,  Ronald Dean Powell

IPC: H01L21/02 ,  H01L21/027

CPC classification number: H01L21/02282 ,  C23C18/00 ,  H01L21/02118 ,  H01L21/0273

Abstract: A method, which forms an air-bubble-free thin film with a high-viscosity fluid resin, initially dispenses the fluid resin on an outer region of a semiconductor wafer while the semiconductor wafer is spinning, and then dispenses the fluid resin onto the center of the semiconductor wafer after the semiconductor wafer has stopped spinning.

公开(公告)号：US09960034B2

公开(公告)日：2018-05-01

申请号：US15369000

申请日：2016-12-05

Applicant: Texas Instruments Incorporated

Inventor： Sandra Zheng ,  Mark James Smiley ,  Douglas Jay Levack ,  Ronald Dean Powell

IPC: H01L21/469 ,  H01L21/02 ,  C23C18/00 ,  H01L21/027

CPC classification number: H01L21/02282 ,  C23C18/00 ,  H01L21/02118 ,  H01L21/0273

Abstract: A method, which forms an air-bubble-free thin film with a high-viscosity fluid resin, initially dispenses the fluid resin on an outer region of a semiconductor wafer while the semiconductor wafer is spinning, and then dispenses the fluid resin onto the center of the semiconductor wafer after the semiconductor wafer has stopped spinning.

公开(公告)号：US09548199B2

公开(公告)日：2017-01-17

申请号：US14481813

申请日：2014-09-09

Applicant: Texas Instruments Incorporated

Inventor： Sandra Zheng ,  Mark James Smiley ,  Douglas Jay Levack ,  Ronald Dean Powell

IPC: H01L21/469 ,  H01L21/02 ,  C23C18/00

CPC classification number: H01L21/02282 ,  C23C18/00 ,  H01L21/02118 ,  H01L21/0273

Abstract: A method, which forms an air-bubble-free thin film with a high-viscosity fluid resin, initially dispenses the fluid resin on an outer region of a semiconductor wafer while the semiconductor wafer is spinning, and then dispenses the fluid resin onto the center of the semiconductor wafer after the semiconductor wafer has stopped spinning.

Abstract translation: 利用高粘度流体树脂形成无气泡的薄膜的方法，首先在半导体晶片旋转的同时在半导体晶片的外部区域分配流体树脂，然后将流体树脂分配到中心 在半导体晶片停止旋转之后的半导体晶片。

公开(公告)号：US20160071725A1

公开(公告)日：2016-03-10

申请号：US14481813

申请日：2014-09-09

Applicant: Texas Instruments Incorporated

Inventor： Sandra Zheng ,  Mark James Smiley ,  Douglas Jay Levack ,  Ronald Dean Powell

IPC: H01L21/02

CPC classification number: H01L21/02282 ,  C23C18/00 ,  H01L21/02118 ,  H01L21/0273

Abstract: A method, which forms an air-bubble-free thin film with a high-viscosity fluid resin, initially dispenses the fluid resin on an outer region of a semiconductor wafer while the semiconductor wafer is spinning, and then dispenses the fluid resin onto the center of the semiconductor wafer after the semiconductor wafer has stopped spinning.

Abstract translation: 利用高粘度流体树脂形成无气泡的薄膜的方法，首先在半导体晶片旋转的同时在半导体晶片的外部区域分配流体树脂，然后将流体树脂分配到中心 在半导体晶片停止旋转之后的半导体晶片。