公开(公告)号：US20240250059A1

公开(公告)日：2024-07-25

申请号：US18530067

申请日：2023-12-05

Applicant: Tokyo Electron Limited

Inventor： Christopher NETZBAND ,  Nathan IP

IPC: H01L23/00

CPC classification number: H01L24/74 ,  H01L24/80 ,  H01L2224/74 ,  H01L2224/80894 ,  H01L2924/40

Abstract: An apparatus for handling a semiconductor wafer includes an upper wafer holder that has a front surface, and a compliant ring that is mounted around the upper wafer holder and has a front surface. The front surface of the compliant ring is flush with the front surface of the upper wafer holder and extends from the front surface of the upper wafer holder in a radial direction without extending beyond the front surface of the wafer holder in an axial direction. A method includes providing a first wafer with a bonding surface and back surface, the back surface of the wafer in contact with the front surfaces of the wafer holder and the compliant ring. The first wafer contacts a second wafer so a bond forms between the wafers in a radial direction, the compliant ring flexibly restricting the movement of the first wafer relative to the second wafer.

公开(公告)号：US20250112083A1

公开(公告)日：2025-04-03

申请号：US18376359

申请日：2023-10-03

Applicant: Tokyo Electron Limited

Inventor： Christopher NETZBAND ,  Adam GILDEA

IPC: H01L21/687 ,  H01L21/18 ,  H01L21/67 ,  H01L21/683

Abstract: Conformal semiconductor chucks are disclosed. The semiconductor chucks can include a first portion comprising a first vacuum pad. The semiconductor chucks can include a second portion exhibiting greater compliance than either of the first portion or a third portion. The semiconductor chucks can include the third portion comprising a second vacuum pad.

公开(公告)号：US20250087521A1

公开(公告)日：2025-03-13

申请号：US18367306

申请日：2023-09-12

Applicant: Tokyo Electron Limited

Inventor： Christopher NETZBAND ,  Adam GILDEA

IPC: H01L21/683 ,  H01L21/67

Abstract: Expandable semiconductor chucks are disclosed. The semiconductor chucks can include a first portion comprising a plurality of first couplers configured to receive a corresponding plurality of actuators. The semiconductor chucks can include a second portion circumscribed about the first portion, the second portion comprising a plurality of segments. Each segment can include a wafer holder to selectively couple the respective segment to a semiconductor wafer. Each segment can include a second coupler to receive one or more of the plurality of actuators. The actuators can extend to increase a dimension between the first portion and the second portion and retract to decrease a dimension between the first portion and the second portion.

公开(公告)号：US20240290748A1

公开(公告)日：2024-08-29

申请号：US18586259

申请日：2024-02-23

Applicant: Tokyo Electron Limited

Inventor： Christopher NETZBAND ,  Hirokazu AIZAWA

IPC: H01L23/00 ,  H05H1/46

CPC classification number: H01L24/80 ,  H05H1/46 ,  H01L2224/80009 ,  H01L2224/80895 ,  H01L2224/80896 ,  H05H2245/40

Abstract: A method is provided for activating a first surface for bonding to a second surface. In some embodiments, the method includes exposing the first surface to a plasma that has a high electron density in a range between 1×109 cm−3 and 1×1012 cm−3 and a low electron temperature of less than 1 eV, and then bonding the first surface to the second surface. In some embodiments, the plasma is generated by a plasma generator using a slot-plane-antenna (SPA) technique. In some embodiments, the plasma also includes a reducing agent.