公开(公告)号：US11814518B2

公开(公告)日：2023-11-14

申请号：US17274061

申请日：2019-07-31

Applicant: UBE CORPORATION

Inventor： Tetsuya Yasui ,  Atsushi Yamashita

IPC: C08L77/02 ,  B29C48/00 ,  B29C48/05 ,  B29K77/00 ,  B29K105/00

CPC classification number: C08L77/02 ,  B29C48/022 ,  B29C48/05 ,  B29K2077/00 ,  B29K2105/0026 ,  C08L2201/08 ,  C08L2205/025 ,  C08L2205/035

Abstract: A polyamide resin composition is provided which can be blow molded while concurrently satisfying blow moldability and uniform wall thickness of the molten resin, exhibits excellent thermal stability when the resin composition is accumulated as a melt and thereby gives molded articles with a good surface appearance, and is further excellent in impact resistance at room and low temperatures. The polyamide resin composition includes, based on 100 mass % of the polyamide resin composition, 40 to 84 mass % of a polyamide resin (A), not less than 15 mass % of an olefin-based ionomer (B), 0 to 10 mass % of an impact modifier (C), and 0.1 to 3 mass % of heat resistant agents (D). The polyamide resin (A) includes at least one selected from the group consisting of aliphatic copolyamides (A-1) and aromatic copolyamides (A-2). The heat resistant agents (D) include two or more kinds of organic hindered phenol heat resistant agents (D-1).

公开(公告)号：US12227644B2

公开(公告)日：2025-02-18

申请号：US17912219

申请日：2021-03-19

Applicant: UBE Corporation

Inventor： Tetsuya Yasui ,  Akane Sakamoto ,  Yuki Suedomi ,  Hitoshi Kodama ,  Kosuke Oishi ,  Takashi Kumagai ,  Mikako Fujita

IPC: B32B7/10 ,  B29C45/00 ,  B29C45/16 ,  B32B27/32 ,  B32B27/34 ,  C08L77/02 ,  B29K71/00 ,  B29K77/00 ,  B29K223/00

Abstract: The present invention relates to a polyamide resin composition that is excellent in mechanical characteristics, bonding properties and calcium chloride resistance and is suitably bonded to an acid-modified polyolefin, wherein the polyamide resin composition includes 70 to 99 mass % of an aliphatic polyamide resin (A) having an amino group concentration of 46 to 110 μmol/g, 0 to 18 mass % of an aromatic polyamide resin (B), 0.01 to 0.50 mass % of a polyalkylene glycol alkyl ether (C), 0.01 to 0.50 mass % of a polyolefin wax (D) and 0 to 22.98 mass % of a component (E) other than (A) to (D), and the total of (A) to (E) is 100 mass %, and wherein the acid-modified polyolefin having an amount of acid modification of 8 to 100 μmol/g.