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公开(公告)号:DE2945139A1
公开(公告)日:1980-05-14
申请号:DE2945139
申请日:1979-11-08
Applicant: UBE INDUSTRIES
Inventor: SASAKI YOSHIKAZU , INOUE HIROSHI , SASAKI ICHIRO , ITATANI HIROSHI , KASHIMA MIKITO
IPC: C08G73/10
Abstract: A polyimide solution is prepared by a process wherein a tetracarboxylic acid ingredient containing at least about 80% by mole of 3,3',4,4'-biphenyltetracarboxylic acid or its functional derivative and an aromatic diamine ingredient containing at least about 50% by mole of 4,4'-diaminodiphenyl ether are polymerized at from about 100 DEG to 300 DEG C. in phenol or a halogenated phenolic compound; the amount of the acid and diamine ingredients being approximately equimolar to each other; whereby polymerization of the tetracarboxylic acid ingredient and the aromatic diamine ingredient is effected while being accompanied by imidation. Preferably, the polymerization accompanied by imidation is effected in a manner such that at least a second half of the polymerization is carried out in a closed reaction system. The resulting polyimide solution is suitable for making therefrom shaped articles, such as films, possessing excellent mechanical properties.
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公开(公告)号:DE2932589A1
公开(公告)日:1980-02-28
申请号:DE2932589
申请日:1979-08-10
Applicant: UBE INDUSTRIES
Inventor: SASAKI ICHIRO , ITATANI HIROSHI , KASHIMA MIKITO , YOSHIMOTO HATAAKI , YAMAMOTO SHUJI , SASAKI YOSHIKAZU
Abstract: An aromatic polyimide resin composition useful for producing a film or sheet, comprises 2% by weight or more of an imide polymer having at least 90 molar % of a recurring unit of the formula (I): (I) wherein R' is a divalent aromatic radical, and dissolved in an organic polar solvent consisting essentially of one or more halogenated phenol compounds of the formulae (II) or (III): (II) and (III) wherein R2 is a hydrogen atom of a C1-3 alkyl radical and is a halogen atom, the halogenated phenol compound having a melting point of 100 DEG C. or less and a boiling point of 300 DEG C. or less.
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公开(公告)号:DE2837726B1
公开(公告)日:1979-12-06
申请号:DE2837726
申请日:1978-08-30
Applicant: UBE INDUSTRIES
Inventor: SASAKI ICHIRO , ITATANI HIROSHI , KASHIMA MIKITO
Abstract: Disclosed is an epoxy resin composition containing, as an essential curing component, 2,3,3',4'-biphenyltetracarboxylic dianhydride which is highly compatible with epoxy resins at a relatively low temperature and effective for producing cured epoxy resins having an excellent thermal resistance.
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公开(公告)号:DE1745515A1
公开(公告)日:1971-09-09
申请号:DE1745515
申请日:1967-09-14
Applicant: UBE INDUSTRIES
Inventor: FUJIKAWA SABURO , SASAKI ICHIRO , TEZUKA KENZO
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公开(公告)号:JPS6337136B2
公开(公告)日:1988-07-22
申请号:JP11355879
申请日:1979-09-06
Applicant: UBE INDUSTRIES
Inventor: SASAKI YOSHIKAZU , INOE HIROSHI , SASAKI ICHIRO , ITAYA HIROSHI , KASHIMA MIKITO
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公开(公告)号:JPS6157858B2
公开(公告)日:1986-12-09
申请号:JP10274678
申请日:1978-08-25
Applicant: UBE INDUSTRIES
Inventor: SASAKI ICHIRO , NAKAJIMA KOHEI , ISHIKAWA HIDEO , HAYASHI JUNNOSUKE , ASANO YUKIHIKO , INAISHI TANETOSHI
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公开(公告)号:JPS6138212B2
公开(公告)日:1986-08-28
申请号:JP10184978
申请日:1978-08-23
Applicant: UBE INDUSTRIES
Inventor: SASAKI ICHIRO , NAKAJIMA KOHEI , ISHIKAWA HIDEO , HAYASHI JUNNOSUKE , ASANO YUKIHIKO , INAISHI TANETOSHI
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公开(公告)号:JPS6337137B2
公开(公告)日:1988-07-22
申请号:JP6715780
申请日:1980-05-22
Applicant: UBE INDUSTRIES
Inventor: SASAKI ICHIRO , KASHIMA MIKITO , YAMAMOTO SHUJI , INOE TOSHIHIRO , TSUMYAMA TATSUO
IPC: C08G73/00 , C08G73/10 , C08G73/12 , C09D179/08
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公开(公告)号:JPS6145652B2
公开(公告)日:1986-10-09
申请号:JP13735678
申请日:1978-11-09
Applicant: UBE INDUSTRIES
Inventor: SASAKI YOSHIKAZU , INOE HIROSHI , SASAKI ICHIRO , ITAYA HIROSHI , KASHIMA MIKITO
IPC: C08L79/08 , C08G73/00 , C08G73/10 , C09D5/25 , C09D179/08 , C09J179/08
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公开(公告)号:JPH02373B2
公开(公告)日:1990-01-08
申请号:JP18789986
申请日:1986-08-12
Applicant: UBE INDUSTRIES
Inventor: SASAKI YOSHIKAZU , INOE HIROSHI , SASAKI ICHIRO , ITAYA HIROSHI
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