POLYAMIDE RESIN COMPOSITION
    1.
    发明申请

    公开(公告)号:US20190023898A1

    公开(公告)日:2019-01-24

    申请号:US16070136

    申请日:2017-01-31

    Inventor: Tetsuya YASUI

    Abstract: Provided is a polyamide resin composition which comprises a polyamide resin (A) and an impact-resistant material (B), wherein the polyamide resin (A) comprises an aliphatic copolyamide (A-1) comprising three or more types of monomers and an aliphatic polyamide (A-2), wherein the content of the aliphatic copolyamide (A-1) in the polyamide resin composition is 1% by mas to 30% by mass.

    POLYAMIDE RESIN COMPOSITION
    3.
    发明申请

    公开(公告)号:US20210347991A1

    公开(公告)日:2021-11-11

    申请号:US17274061

    申请日:2019-07-31

    Abstract: A polyamide resin composition is provided which can be blow molded while concurrently satisfying blow moldability and uniform wall thickness of the molten resin, exhibits excellent thermal stability when the resin composition is accumulated as a melt and thereby gives molded articles with a good surface appearance, and is further excellent in impact resistance at room and low temperatures. The polyamide resin composition includes, based on 100 mass % of the polyamide resin composition, 40 to 84 mass % of a polyamide resin (A), not less than 15 mass % of an olefin-based ionomer (B), 0 to 10 mass % of an impact modifier (C), and 0.1 to 3 mass % of heat resistant agents (D). The polyamide resin (A) includes at least one selected from the group consisting of aliphatic copolyamides (A-1) and aromatic copolyamides (A-2). The heat resistant agents (D) include two or more kinds of organic hindered phenol heat resistant agents (D-1).

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