公开(公告)号：US20220238477A1

公开(公告)日：2022-07-28

申请号：US17583364

申请日：2022-01-25

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： HSIEN-TE CHEN

IPC: H01L23/00 ,  H01L25/075

Abstract: An electronic device includes a substrate, a plurality of micro semiconductor structure, a plurality of conductive members, and a non-conductive portion. The substrate has a first surface and a second surface opposite to each other. The micro semiconductor structures are distributed on the first surface of the substrate. The conductive members electrically connect the micro semiconductor structures to the substrate. Each conductive member is defined by an electrode of one of the micro semiconductor structures and a corresponding conductive pad on the substrate. The non-conductive portion is arranged on the first surface of the substrate. The non-conductive portion includes one or more non-conductive members, and the one or more non-conductive members are attached to the corresponding one or more conductive members of the one or more micro conductive structures.

公开(公告)号：US20200350298A1

公开(公告)日：2020-11-05

申请号：US16864753

申请日：2020-05-01

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： HSIEN-TE CHEN

IPC: H01L25/075 ,  H01L33/62 ,  H01L27/15 ,  H01L33/24

Abstract: A micro semiconductor stacked structure includes at least two stacked structure array units, wherein one stacked structure array unit is stacked on the other stacked structure array unit. In particular, the stacked structure array unit is stacked on the other stacked structure array unit along a vertical direction. Each stacked structure array unit includes a substrate, a conductive pattern layer disposed on the substrate, and a plurality of micro semiconductor devices disposed on the substrate and electrically connected to the conductive pattern layer.