公开(公告)号：US20140151099A1

公开(公告)日：2014-06-05

申请号：US13845339

申请日：2013-03-18

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： CHENG MING WENG ,  WEI-MING CHENG ,  HAN-PEI HUANG

IPC: H05K1/11 ,  H05K3/46

CPC classification number: H05K1/115 ,  H05K1/0366 ,  H05K3/0035 ,  H05K2201/09827

Abstract: A laser drilling method of a wiring board is provided. In the method, a laser beam shines on a wiring substrate including an insulating layer to remove a portion of the insulating layer. The wiring substrate is placed in a focus section of the laser beam. The focus section contains a central region, an optical axis located in the central region, and a peripheral region surrounding the central region. The maximum light intensity of the focus section is located in the peripheral region.

Abstract translation: 提供一种布线板的激光钻孔方法。 在该方法中，激光束照射在包括绝缘层的布线基板上，以去除绝缘层的一部分。 布线基板被放置在激光束的聚焦部分中。 焦点部分包含中心区域，位于中心区域的光轴以及围绕中心区域的周边区域。 焦点部分的最大光强度位于周边区域。