公开(公告)号：US20140099432A1

公开(公告)日：2014-04-10

申请号：US13727600

申请日：2012-12-27

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Tzyy-Jang Tseng ,  Chang-Ming Lee ,  Wen-Fang Liu ,  Cheng-Po Yu

IPC: H05K3/00

CPC classification number: H05K3/007 ,  H05K3/0097 ,  H05K3/381 ,  H05K2201/0154

Abstract: A fabrication method for a flexible circuit board is provided. The fabrication method includes the following steps. Firstly, a release film having an upper surface and a lower surface opposite to each other is provided. Next, two flexible substrates are respectively disposed on the upper surface and the lower surface. Next, a plurality of nano-scale micro-pores are formed on each flexible substrate to form two non-smooth flexible substrates. The nano-scale micro-pores evenly distributed over an outer surface of each non-smooth flexible substrate. Each non-smooth flexible substrate being adapted to be performed a plating process directly on the outer surface thereof.

Abstract translation: 提供了一种柔性电路板的制造方法。 制造方法包括以下步骤。 首先，提供具有彼此相对的上表面和下表面的剥离膜。 接下来，在上表面和下表面上分别设置两个柔性基板。 接下来，在每个柔性基板上形成多个纳米级微孔，以形成两个非平滑柔性基板。 纳米级微孔均匀分布在每个非光滑柔性基底的外表面上。 每个非光滑柔性基底适于在其外表面上直接进行电镀工艺。