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公开(公告)号：US20230215772A1
公开(公告)日：2023-07-06
申请号：US17586106
申请日：2022-01-27
Applicant: UNIMICRON TECHNOLOGY CORP.
Inventor： WEN YU LIN , KAI-MING YANG , PU-JU LIN
CPC classification number: H01L23/15 , C03C17/002 , C03C17/42 , C03C17/225 , H01L23/10 , H01L23/291 , C03C2218/154 , H05K1/0306
Abstract: The invention discloses a glass carrier having a protection structure, comprising a glass body and a protection layer. The glass body has a top surface, a bottom surface, and a lateral surface. The protection layer covers the lateral surface of the glass body. The protection layer is a hard material with a stiffness coefficient higher than a stiffness coefficient of the glass body. The invention further discloses a manufacturing method of a glass carrier having a protection structure, comprising the following steps: covering the protection layer around the lateral surface of the glass body, wherein the protection layer is the hard material with the stiffness coefficient higher than the stiffness coefficient of the glass body.
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公开(公告)号：US20230335419A1
公开(公告)日：2023-10-19
申请号：US17741787
申请日：2022-05-11
Applicant: UNIMICRON TECHNOLOGY CORP.
Inventor： Chin-Sheng Wang , Chia-Yu Peng , KAI-MING YANG , PU-JU LIN , CHENG-TA KO
Abstract: The present invention provides an etching device which comprises an oxygen supplier, so that the etching device of the present invention can etch copper gently by means of the dissolved oxygen in the etching solution to accurately control the etching degree so as to fulfill the stricter requirements of microcircuit manufacturing. The present invention further provides an etching method. Finally, the etching waste solution of the present invention can be recycled to further ameliorate the environmental pollution and reduce the production cost, so the present invention is widely applicable in integrated circuit packaging.
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