公开(公告)号：US11234324B1

公开(公告)日：2022-01-25

申请号：US17171814

申请日：2021-02-09

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Ping-Che Yang ,  Tsun-Sheng Chou ,  Yan-Jia Peng

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/40 ,  H05K1/11 ,  H05K3/00

Abstract: A circuit board structure includes a first dielectric layer, at least one first circuit layer, a second dielectric layer, and an insulating protection layer. The first circuit layer is mounted on the first dielectric layer, and includes at least one first circuit. The second dielectric layer is mounted on the first circuit layer, and includes at least one thermally conductive bump and at least one electrically conductive bump. The electrically conductive bump is electrically connected to the first circuit. The insulating protection layer is mounted on the second dielectric layer. The thermally conductive bump directly contacts the glass substrate. When lasering is applied to cut the glass substrate for de-bonding, the lasering heat energy can be absorbed and dissipated by the thermally conductive bump, resolving the problem of circuit de-bonding and raising the process yield. In addition, a manufacturing method of the circuit board structure is provided.