公开(公告)号：JP2000269309A

公开(公告)日：2000-09-29

申请号：JP7587799

申请日：1999-03-19

Applicant: UNITED MICROELECTRONICS CORP

Inventor： CHOU CHII-HON ,  RUU UEN-CHOAN

IPC: H01L21/683 ,  H01L21/68

Abstract: PROBLEM TO BE SOLVED: To provide a mounting device of a structure, wherein a semiconductor wafer having one linear edge is not only made horizontally fixed but also prevented from being damaged on the corners of the wafer. SOLUTION: This device is a mounting device for fixing a semiconductor wafer, which consists of a round base to be mounted with the wafer and a round clamp consisting of a round aperture 28 having a plurality of teeth provided at equal intervals, on the peripheral side of the aperture 28 for fixing the wafer on the base by applying a pressure under the lower part of the water, when the wafer is mounted on the base and has one linear edge.