公开(公告)号：JPH1190819A

公开(公告)日：1999-04-06

申请号：JP31313697

申请日：1997-11-14

Applicant: UNITED MICROELECTRONICS CORP

Inventor： KIYU UNBO ,  YO SHIKIYO ,  HO HOUI ,  GO TOSHIMOTO ,  RAI TAKEOKI

IPC: B24B37/04 ,  B24B37/30 ,  B24B37/32 ,  B24B57/02

Abstract: PROBLEM TO BE SOLVED: To provide a polishing head retaining ring for CMP(chemical- mechanical polishing) device with which the slurry coated in the CMP process can be distributed uniformly over the surface of a wafer polished by the polishing head. SOLUTION: A head retaining ring 40 is designed for use in a CMP device equipped with a polishing table, polishing pad, polishing head to hold a semiconductor wafer held in a fixed position, and a means to coat a constant amount of slurry to the wafer, wherein the head includes an air compressing means to apply an air pressure to a wafer loader used to hold the wafer in the specified position. This ring 40 is constructed so as to have a plurality of linear grooves 42 arranged at an approx. constant angular spacing, and the grooves 42 are inclined in the radial direction so as to form an acute angle of attack to the slurry existing outside the ring when it rotates.