公开(公告)号：JPH08124421A

公开(公告)日：1996-05-17

申请号：JP25563994

申请日：1994-10-20

Applicant: UNITED MICROELECTRONICS CORP

Inventor： NENGU FUSHINGU RU ,  NINGU YANGU ,  JIEI SHII DENGU ,  DEITSUKU RIYAO

IPC: H05K1/09 ,  C09J9/02 ,  C09J11/04 ,  H01B1/00 ,  H01B1/22 ,  H01B5/00 ,  H01B5/16 ,  H01R11/01 ,  H05K3/32

Abstract: PURPOSE: To provide an adhesive for connecting a circuit member having a conductive terminal to a substrate having a mounting surface equipped with a plurality of tracks on its side part and to provide a connecting method which can secure reliable electric connection by making a conductive terminal adhere steadfastly to a necessary position. CONSTITUTION: A conductive adhesive comprises at least 10 wt.% of compressed hollow conductive particles dispersed in a non-conductive resin. A connecting method consists of the following five steps of: (a) applying the above-mentioned adhesive to a surface of a substrate on which a circuit member is to be mounted; (b) mounting a conductive terminal of the circuit member on a pre-selected conductive passage among passages, adjusting the terminal vertically to the passage with the help of adhesive; (c) applying a magnetic field vertically to a complex consisting of a combination of a mounting surface, the adhesive, and the circuit member and collecting conductive particles between the conductive terminal and the passage; (d) applying a pressure to the circuit member under the existence of the magnetic field, so that a part of adhesive is made to be squeezed from between the conductive terminal and the passage; and (e) hardening the adhesive.