公开(公告)号：JP2000332197A

公开(公告)日：2000-11-30

申请号：JP13319599

申请日：1999-05-13

Applicant: UNITED MICROELECTRONICS CORP

Inventor： SEN MEICHI ,  RIN SEITOKU

IPC: H01L27/04 ,  H01L21/822

Abstract: PROBLEM TO BE SOLVED: To reduce the size of a package and to simplify a packaging process. SOLUTION: The wafer level package is provided with a silicon chip 11 with an integrated circuit device 14, insulation layers 18a-18c for covering the integrated circuit device 14, a bonding pad 24 that is dispersively arranged along an edge 35 of the silicon chip 11 and further is electrically connected to the terminal of the integrated circuit device 14, a protection layer 30 for covering one portion of the insulation layer 18c and the bonding pad 24, a metal layer 34 that covers the exposed part of the bonding pad 24 and is extended to the edge 35, a packaging layer 36 that is provided on the protection layer 34, and a plurality of metal bumps 38 being provided on the metal layer 34.

公开(公告)号：JP2000223651A

公开(公告)日：2000-08-11

申请号：JP2226499

申请日：1999-01-29

Applicant: UNITED MICROELECTRONICS CORP

Inventor： SEN MEICHI ,  RIN SEITOKU

IPC: H01L25/18 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/522 ,  H01L25/065 ,  H01L25/07

Abstract: PROBLEM TO BE SOLVED: To reduce thickness and surface area by providing a lead frame with a die pad and several leads each having inner and outer lead parts. SOLUTION: A lead frame being used as a film carrier has a die pad 50 and a plurality of leads 56 each constituting inner and outer leads 52, 54. Chips 58, 60, 62, 64, 66 having faces 58a-66a arranged with a plurality of pads 68 on the die pad 50 are contained in one package having volume substantially equal to the total volume of all chips 58-66 which are then wire bonded to the lead frame. According to the structure, a thin package for facing multichip having small surface area can be obtained.

公开(公告)号：JP2000223654A

公开(公告)日：2000-08-11

申请号：JP2226299

申请日：1999-01-29

Applicant: UNITED MICROELECTRONICS CORP

Inventor： SEN MEICHI ,  RIN SEITOKU

IPC: H01L25/18 ,  H01L21/60 ,  H01L25/065 ,  H01L25/07 ,  H01L27/10

Abstract: PROBLEM TO BE SOLVED: To reduce thickness and surface area by providing a film carrier with a plurality of conductive wires arranged on an insulation film. SOLUTION: Two chips 50, 52 of different size are contained in one package of substantially the same size as that of the larger one of the chips 50, 52 such that the chip 50 has a wider surface area than the chip 52. The chip 52 is placed on same surface as the insulation film 54 of a film carrier 58, a protrusion 66 of the chip 52 is surrounded by the insulation film 54 of the film carrier 58 and a plurality of conductive wires 56 are arranged on an insulation film. These conductive wires 56 are made thinner than a conductive wire being used in another type of carrier and the width thereof is also limited.

公开(公告)号：JP2000223650A

公开(公告)日：2000-08-11

申请号：JP2226399

申请日：1999-01-29

Applicant: UNITED MICROELECTRONICS CORP

Inventor： SEN MEICHI ,  RIN SEITOKU

IPC: H01L25/18 ,  H01L23/495 ,  H01L25/065 ,  H01L25/07

Abstract: PROBLEM TO BE SOLVED: To obtain a thin chip scale IC package for multichip having a small surface area by arranging a plurality of chips on a film carrier while facing each other using flip-chip technology and filling the space between chips with an insulating material while exposing the other side of each chip. SOLUTION: A chip scale IC package for multichip uses a film carrier 58 in order to contain multichips 50, 52, 54, 56. Two chips 50, 56 are arranged on two faces of the film carrier 58 while facing each other using flip-chip technology. Each chip 50, 52, 54, 56 has one protrusion 72 connected with the film carrier 58. The space between the chips 50, 52, 54, 56 is filled with an insulating material 76 and the other surface is exposed. Furthermore, signal transmission route is shortened in order to transmit an external signal directly by forming a conductive wire 60 on the film carrier 58.

公开(公告)号：JP2000223649A

公开(公告)日：2000-08-11

申请号：JP2226199

申请日：1999-01-29

Applicant: UNITED MICROELECTRONICS CORP

Inventor： SEN MEICHI ,  RIN SEITOKU

IPC: H01L25/18 ,  H01L23/498 ,  H01L23/522 ,  H01L25/065 ,  H01L25/07

Abstract: PROBLEM TO BE SOLVED: To obtain a very small chip scale IC package only slightly larger than a chip contained therein by filling the gap between chips with an insulating material to cover the element surface of two chips while exposing the back face thereof thereby forming an insulation compound. SOLUTION: First and second chips 50, 52 have element surfaces 60, 62 facing the opposite side face of a film carrier 58 and bonding pads of two chips 50, 52 are connected electrically with a conductive wire 56 on a film carrier 58 through first and second conductive protrusions 64, 66. An insulating material fills the space between two chips 50, 52 to form an insulation compound 68. The insulation compound 68 seals only the conductive protrusions 64, 66 and the element surfaces 60, 62 of the chips 50, 52 such that the back faces 70, 72 of the first and second chips 50, 52 are exposed.