公开(公告)号：JP2000315717A

公开(公告)日：2000-11-14

申请号：JP11707799

申请日：1999-04-23

Applicant: UNITED MICROELECTRONICS CORP

Inventor： TEI CHOGEN

IPC: H01L21/677 ,  H01L21/68

Abstract: PROBLEM TO BE SOLVED: To provide a wafer extruder, which prevents wafers from being broken or from being dually laminated, in a vertical wafer carrying system. SOLUTION: A vertical wafer carrying system is provided with a wedge type wafer extruder 130 on a wafer boat 120 for vertically carrying a plurality of wafers 110. The wafers 110 are put in the same slant direction during the time when the wafers 110 are vertically carried and the wedge type wafer extruder 130 is provided with a slant face for supporting the wafers 110.