公开(公告)号：JP2000216323A

公开(公告)日：2000-08-04

申请号：JP1231099

申请日：1999-01-20

Applicant: UNITED MICROELECTRONICS CORP

Inventor： YO TOKUSEI

IPC: H01L23/50

Abstract: PROBLEM TO BE SOLVED: To prevent a die pad from floating by installing a plurality of contact pads and leads in a lead frame for loading a chip and arranging the leads around the contact pads. SOLUTION: In a lead frame 40, a plurality of leads 42 are installed around a loading area 48 and a plurality of contact pads 44 near the side edges of the loading area 48. The contact pads 44 are formed by connecting the prescribed number of extending leads 42. The leads 42 selected for forming the contact pads 44 have the same voltages. The contact pads 44 are substituted for former die pads for supporting and loading chips. Thus, the contact pads 44 formed by connecting the prescribed number of extending leads 42 can be substituted for the former die pads and the occurrence of floating can be prevented in a forming step. Then, the occurrence of a crack in wire bonding can be prevented.