公开(公告)号：EP3071814A4

公开(公告)日：2017-07-19

申请号：EP14863876

申请日：2014-10-21

Applicant: UNITED TECHNOLOGIES CORP

Inventor： LYDERS DAVID R ,  HOLYFIELD MARC E ,  BELL KEVIN M

IPC: F02C7/047 ,  F01D25/02 ,  F02C7/20

CPC classification number: F01D25/02 ,  B29C70/48 ,  B29C70/882 ,  F02C7/047 ,  F02K3/02 ,  F05D2220/36 ,  F05D2260/20 ,  F05D2300/40 ,  F05D2300/603 ,  H05B3/026 ,  H05B3/42 ,  H05K1/0212 ,  H05K1/0296 ,  H05K3/0014 ,  Y02T50/672

Abstract: A method of forming a circuit in a composite component includes providing a plurality of preform modules comprised of an organic matrix composite material, applying at least one electrical circuit on at least first and second preform modules of the plurality of preform modules, and arranging the first and second preform modules such that the electrical circuit of the first preform module is in contact with the electrical circuit of the second preform module. An additional step includes molding the first and second preform modules together to form a one-piece molded component such that the electrical circuits of the first and second preform modules form a complete circuit.

Abstract translation: 一种在复合部件中形成电路的方法包括提供多个由有机基质复合材料构成的预成形模块，在至少一个预成形模块的第一和第二预成形模块上应用至少一个电路，并且将第一 和第二预成形模块，使得第一预成形模块的电路与第二预成形模块的电路接触。 额外的步骤包括将第一和第二预成形模块模制在一起以形成单件式模制部件，使得第一和第二预成形模块的电路形成完整的电路。