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    3.
    发明专利
    未知

    公开(公告)号：DK0862729T3

    公开(公告)日：2002-05-13

    申请号：DK96940596

    申请日：1996-11-21

    Applicant: UNITED TECHNOLOGIES CORP

    Inventor： DUNPHY JAMES R ,  RUKUS ROBERT M ,  HA JONG-MIN

    IPC: B29C35/02 ,  B29C70/54 ,  G01B11/16 ,  G01C19/56 ,  G01D5/353 ,  G01H11/06 ,  G01M11/08 ,  G01N11/00 ,  G01N33/44 ,  G01P15/125 ,  G01K11/32 ,  G01L1/24

    Abstract: Resin curing of a composite laminated structure is monitored using an optical fiber 20 having a grating sensor 28 embedded therein. The fiber 20 is surrounded by upper and lower buffer regions 12,14 having a predetermined minimum number of layers 30 (or thickness) with uni-directional reinforcing filaments 32 and resin 34 therebetween. When the filaments 32 are oriented perpendicular to the longitudinal axis of the fiber 20, the buffer regions 12,14 allow the sensor 28 to exhibit maximum sensitivity to detection of the minimum resin viscosity and the gelation point (i.e., the onset of a rapid crosslinking rate) of the resin 34. The buffer regions 12,14 also have a minimum thickness which serve to isolate the sensor 28 from interfering stresses from arbitrarily angled filaments 32 in layers 30 of outer regions 10,16 which surround the buffer regions 12,14.

    OPTICAL FIBER ENTRY STRAIN RELIEF INTERFACE FOR COMPRESSION-MOLDED STRUCTURES
    6.
    发明专利
    OPTICAL FIBER ENTRY STRAIN RELIEF INTERFACE FOR COMPRESSION-MOLDED STRUCTURES 未知

    公开(公告)号：GR3031366T3

    公开(公告)日：2000-01-31

    申请号：GR990402460

    申请日：1999-09-29

    Applicant: UNITED TECHNOLOGIES CORP

    Inventor： DUNPHY JAMES R ,  RUKUS ROBERT M ,  HA JONG-MIN

    IPC: G02B6/00 ,  G02B6/36 ,  G02B6/38 ,  G02B6/44

    Abstract: An optical fiber entry strain relief interface includes a composite structure (lay-up) 10 having an optical fiber 20 embedded therein. The optical fiber 20 enters (or exits) the lay-up 10 at at least one point 24 and passes through transition layers 47 comprising an adhesive film 42, a thin rubber sealing layer 44, and a thick rubber strain relief layer 46, and through a polymer plug 48 located above the layer 46. The lay-up is consolidated by heating the lay-up over a temperature profile and applying pressure through mostly closed compression molding tools 30,32. The adhesive film 42 bonds the adjacent layer 44 to the upper surface of the lay-up 10, the sealing layer 44 becomes soft enough to seal around the fiber 20 at a temperature lower than the temperature at which the resin 16 exhibits a low enough viscosity to leak out of the lay-up 10, thereby preventing the resin from leaking out of the lay-up 10 during lay-up consolidation, the strain relief layer 46 provides a rubber strain relief for the optical fiber 20, and the plug 48 supports the layers 47 during consolidation.

    8.
    发明专利
    未知

    公开(公告)号：DE60111095T2

    公开(公告)日：2005-10-27

    申请号：DE60111095

    申请日：2001-03-02

    Applicant: UNITED TECHNOLOGIES CORP HARTF

    Inventor： REY NANCY M ,  RUKUS ROBERT M ,  MILLER ROBIN MIHEKUN ,  KETTLE JOHN L ,  TILLMAN THOMAS G

    IPC: G12B1/00 ,  C22F1/00 ,  F03G7/06

    Abstract: A self contained shape memory alloy (SMA) mechanism (50) is presented comprising a first anchor (52) and a second anchor (54) with a SMA actuator (56) and a return member (58) disposed therebetween. The SMA actuator (56) is a SMA bundle formed of single wires. The return member (58) is a linear spring surrounding the SMA actuator (56). Each mechanism (50) also includes a heating means. In operation, with the SMA actuator (56) in a martensitic state, the spring (58) of the mechanism (50) stretches the SMA actuator (56). When the SMA actuator (56) is heated to achieve its austenitic state, the force of the SMA actuator overcomes the force of the spring and pulls the anchors (52,54) thereby actuating at least one of the anchors (52,54). One major benefit of the mechanisms (50) is the ability to repeatably generate high active force in a compact package.

    9.
    发明专利
    未知

    公开(公告)号：DE60111095D1

    公开(公告)日：2005-07-07

    申请号：DE60111095

    申请日：2001-03-02

    Applicant: UNITED TECHNOLOGIES CORP HARTF

    Inventor： REY NANCY M ,  RUKUS ROBERT M ,  MILLER ROBIN MIHEKUN ,  KETTLE JOHN L ,  TILLMAN THOMAS G

    IPC: G12B1/00 ,  C22F1/00 ,  F03G7/06

    Abstract: A self contained shape memory alloy (SMA) mechanism (50) is presented comprising a first anchor (52) and a second anchor (54) with a SMA actuator (56) and a return member (58) disposed therebetween. The SMA actuator (56) is a SMA bundle formed of single wires. The return member (58) is a linear spring surrounding the SMA actuator (56). Each mechanism (50) also includes a heating means. In operation, with the SMA actuator (56) in a martensitic state, the spring (58) of the mechanism (50) stretches the SMA actuator (56). When the SMA actuator (56) is heated to achieve its austenitic state, the force of the SMA actuator overcomes the force of the spring and pulls the anchors (52,54) thereby actuating at least one of the anchors (52,54). One major benefit of the mechanisms (50) is the ability to repeatably generate high active force in a compact package.

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