Method for plating articles with particles in a metal matrix
    2.
    发明授权
    Method for plating articles with particles in a metal matrix 失效
    用金属基体中的颗粒电镀制品的方法

    公开(公告)号:US3922207A

    公开(公告)日:1975-11-25

    申请号:US47548774

    申请日:1974-05-31

    CPC classification number: C25D5/22 B24D18/0018 C25D15/02

    Abstract: The surface of a workpiece which is to be plated is immersed in a plating solution of particles dispersed in a metal salt dissolved in an aqueous solution. The plating solution flows between the surface and an abrasive tool which rubs against the surface. An electric current is passed from the tool through the plating solution into the workpiece thereby causing metal ions to plate out as metal onto the surface of the workpiece. The particles within the plating solution become entrapped in the plated out matrix material. The pressure of the abrasive tool against the surface is enough to remove surface roughness but not enough to remove all the metal that is being plated out so that the coating builds up on the surface with the particles entrapped therein. The particle size, the pressure of the tool against the workpiece and the dispersal of the particles in the plating solution are several of the parameters which are controlled to achieve a uniform, high volume percent of particles within the plated matrix material. In a preferred embodiment the abrasive tool is a honing tool which rotates and reciprocates relative to the surface of the workpiece being plated.

    Abstract translation: 要被电镀的工件的表面浸入分散在溶解在水溶液中的金属盐中的颗粒的镀液中。 电镀液在表面和摩擦表面的研磨工具之间流动。 电流从工具通过电镀溶液进入工件,从而使金属离子作为金属沉积在工件的表面上。 电镀溶液中的颗粒被截留在电镀基质材料中。 研磨工具抵抗表面的压力足以去除表面粗糙度,但不足以除去所有被电镀的金属,使得涂层在包裹在其中的颗粒的表面上积聚。 颗粒尺寸,工具对工件的压力和电镀溶液中颗粒的分散是控制的几个参数,以实现均匀,高体积百分比的镀层基体材料中的颗粒。 在优选实施例中,研磨工具是珩磨工具,其相对于被镀工件的表面旋转和往复运动。

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