METHOD FOR ENHANCING BOND STRENGTH THROUGH IN-SITU PEENING
    1.
    发明公开
    METHOD FOR ENHANCING BOND STRENGTH THROUGH IN-SITU PEENING 审中-公开
    VERFAHREN ZUR VERBESSERUNG DER HAFTFESTIGKEIT DURCH IN-SITU-KUGELSTRAHLEN

    公开(公告)号:EP3060694A4

    公开(公告)日:2017-07-19

    申请号:EP14855520

    申请日:2014-10-17

    CPC classification number: C23C24/04 B24C1/10 B32B15/01

    Abstract: One embodiment includes a method for enhancing bond strength between a powder deposit and a substrate. Powder is deposited on the substrate. Powder is shot peened with peening media that is harder than both the powder and the substrate to produce bond strength between the powder and the substrate that is at least twice bond strength between the powder and the substrate without shot peening.

    Abstract translation: 一个实施方案包括用于增强粉末沉积物与基材之间的结合强度的方法。 粉末沉积在基板上。 用喷丸介质喷射粉末,该喷丸介质比粉末和基材都硬,以产生粉末和基材之间的结合强度,其在粉末和喷丸材料基材之间的结合强度至少是没有喷丸强化的两倍。

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