-
公开(公告)号：SG10201603121UA
公开(公告)日：2016-11-29
申请号：SG10201603121U
申请日：2016-04-20
Applicant: UNITED TECHNOLOGIES CORP
Inventor： LIM YUAN KWANG , CHEE YAO HUI , ZHENG CHUAN CHEN , CHARLENE KWAN YEE LING , MARIO P BOCHIECHIO , AWADH B PANDEY , DILIP M SHAH
Abstract: A pour liner for a shot sleeve of a die-casting system including a bonding layer within a slot in a shot sleeve substrate and a refractory metal layer adjacent to the bonding layer. A method of manufacturing a shot sleeve including forming a slot in the slot sleeve, laser cladding a bonding layer within the slot, and laser cladding a refractory metal layer onto the bonding layer.
Search Results
1
records
(took 0.047 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
