公开(公告)号：WO1992009911A1

公开(公告)日：1992-06-11

申请号：PCT/US1991005832

申请日：1991-08-14

Applicant: UNITED TECHNOLOGIES CORPORATION

Inventor： UNITED TECHNOLOGIES CORPORATION ,  HOCKADAY, Bruce, D.

IPC: G02B06/30

CPC classification number: G02B6/30 ,  G02B6/4202 ,  G02B6/4203

Abstract: A method of aligning the optical axis in the core of an optical fiber with the optical axis in a waveguide imbedded in an integrated optical (IO) chip includes the step of coating an end face of the fiber with a layer of solder such that the solder coating covers the cladding portion of the fiber without covering the core portion of the fiber. The IO chip has a block of similar IO material mounted to a surface of the chip such that a planar end face of the chip is aligned with a planar end face of the block. The end faces of the block/chip are coated with a layer of solder such that the solder coating covers the entire end face of the block/chip without covering the waveguide. The coated fiber end face is brought in contact with the solder coated end face of the block/chip such that the core and waveguide are in approximate axial alignment. The solder layers on the fiber and block/chip end faces are then melted whereby the resulting surface tension forces are such that the optical axes of the core and waveguide are in precise alignment.

公开(公告)号：WO1993007520A1

公开(公告)日：1993-04-15

申请号：PCT/US1992008540

申请日：1992-10-07

Applicant: UNITED TECHNOLOGIES CORPORATION

Inventor： UNITED TECHNOLOGIES CORPORATION ,  HOCKADAY, Bruce, D. ,  MONTGOMERY, Schuyler, W. ,  CARRIER, Geary, R. ,  SUCHOSKI, Paul, G., Jr.

IPC: G02B06/26

CPC classification number: G02B6/30

Abstract: A method of attaching an optical fiber to an IOC includes the step of forming an alignment groove in the waveguide surface of the IOC by utilizing a laser ablation system to remove a predetermined portion of the IOC material. Next, a dicing saw or other cutting means is used to cut into the IOC at a depth less than the thickness of the IOC, the cut forming a cut surface which is normal or at an angle with respect to both an optical axis of the waveguide and to an axis of the alignment groove, such step of cutting performing the additional function of optically polishing the cut surface. Next, an optical fiber is disposed within the alignment groove, and the fiber core is optically aligned with the optical axis of the waveguide by translational and rotational positioning of the fiber end face adjacent to the cut surface. The fiber end face is then secured to the cut surface with adhesive or other suitable means, and the fiber is attached to the IOC within the alignment groove with adhesive or other suitable means.

公开(公告)号：WO1992009912A1

公开(公告)日：1992-06-11

申请号：PCT/US1991005833

申请日：1991-08-14

Applicant: UNITED TECHNOLOGIES CORPORATION

Inventor： UNITED TECHNOLOGIES CORPORATION ,  HOCKADAY, Bruce, D.

IPC: G02B06/42

CPC classification number: G02B6/30 ,  G02B6/4202

Abstract: A method of aligning the optical axes of an optical fiber and a waveguide imbedded in an integrated optical chip and of attaching the fiber to the chip includes the step of coating the outer surface of the fiber with solder in the vicinity of an end of the fiber. A portion of the fiber (10) at the coated end is cut away such that a flat surface at a tangential or near tangential relation to the fiber core results. A surface (22) of the chip (24) has solder pads (26, 28) disposed thereon such that the outer edges of the cut portion of the fiber contacts the solder pads when the flat surface of the fiber is placed in contact with the surface of the chip, such placement of the fiber onto the chip providing for vertical alignment of the optical axes of the fiber core and the waveguide (30) in the chip. Finally, the solder on the outer fiber surface and on the solder pads is heated at the junction therebetween, the resulting surface tension forces bringing the optical axis of the fiber core into precise optical alignment with the optical axis of the waveguide in the chip.

公开(公告)号：WO1993007519A1

公开(公告)日：1993-04-15

申请号：PCT/US1992008541

申请日：1992-10-07

Applicant: UNITED TECHNOLOGIES CORPORATION

Inventor： UNITED TECHNOLOGIES CORPORATION ,  HOCKADAY, Bruce, D.

IPC: G02B06/12

CPC classification number: G02B7/008 ,  G02B6/30

Abstract: A package for an IOC fabricated from an anisotropic material, such as X-cut lithium niobate or lithium tantalate, having identical thermal expansion coefficients in the X and Y directions and a different thermal expansion in the Z direction, or for an IOC fabricated from an isotropic material, such as gallium arsenide or silicon, includes an IOC enclosure having a planar mounting surface which has identical thermal expansion coefficients in the X and Y directions. The coefficients of the planar mounting surface are relatively similar to the thermal expansion coefficients of a planar surface of the IOC. A planar surface of the IOC is attached to the planar mounting surface of the package.

公开(公告)号：WO1992005457A1

公开(公告)日：1992-04-02

申请号：PCT/US1991004678

申请日：1991-07-01

Applicant: UNITED TECHNOLOGIES CORPORATION

Inventor： UNITED TECHNOLOGIES CORPORATION ,  HOCKADAY, Bruce, D.

IPC: G02B06/12

CPC classification number: G02B6/122

Abstract: A wedge-shaped block of pyrolytic graphite or other suitable anisotropic material cut along certain predetermined angular dimensions is used as a thermal expansion coefficient transformer to match the anisotropic thermal expansion coefficients of a lithium niobate or lithium tantalate IO chip to an isotropic substrate material such as 316 stainless steel or aluminum, or to match the isotropic thermal expansion coefficients of a silicon IO chip to an isotropic substrate material, the wedge being used as an intermediate block mounted between the IO chip and the substrate, the anisotropic material used as the thermal transformer having a thermal expansion coefficient which is greater than the value of the thermal expansion coefficient of the IO chip material in one direction, and having a thermal expansion coefficient which is lesser than the thermal expansion coefficient of the IO chip material in another direction.

公开(公告)号：EP0607328A1

公开(公告)日：1994-07-27

申请号：EP92922174.0

申请日：1992-10-07

Applicant: UNITED TECHNOLOGIES CORPORATION

Inventor： HOCKADAY, Bruce, D.

IPC: G02B6 ,  G02B7

CPC classification number: G02B7/008 ,  G02B6/30

Abstract: Boîtier conçu pour une puce optique intégrée fabriquée à partir d'un matériau anisotrope, tel que du niobate de lithium coupé en X ou du tantalate de lithium, possédant des coefficients identiques de dilatation thermique dans les sens X et Y et une dilatation thermique différente dans le sens Z, ou bien conçue pour une puce optique intégrée fabriquée à partir d'un matériau isotrope, tel que de l'arséniure de gallium ou du silicium; ledit boîtier comporte une enveloppe de puce optique intégrée possédant une surface de montage plane présentant des coefficients de dilatation thermique identiques dans les sens X et Y. Les coefficients de la surface de montage plane sont relativement semblables aux coefficients de dilatation thermique d'une surface plane de la puce. Une surface plane de la puce est fixée à la surface de montage plane du boîtier.

公开(公告)号：EP0607328B1

公开(公告)日：1996-09-11

申请号：EP92922174.5

申请日：1992-10-07

Applicant: UNITED TECHNOLOGIES CORPORATION

Inventor： HOCKADAY, Bruce, D.

IPC: G02B6/12

CPC classification number: G02B7/008 ,  G02B6/30

Abstract: A package for an IOC fabricated from an anisotropic material, such as X-cut lithium niobate or lithium tantalate, having identical thermal expansion coefficients in the X and Y directions and a different thermal expansion in the Z direction, or for an IOC fabricated from an isotropic material, such as gallium arsenide or silicon, includes an IOC enclosure having a planar mounting surface which has identical thermal expansion coefficients in the X and Y directions. The coefficients of the planar mounting surface are relatively similar to the thermal expansion coefficients of a planar surface of the IOC. A planar surface of the IOC is attached to the planar mounting surface of the package.