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公开(公告)号:EP2715778A4
公开(公告)日:2014-11-19
申请号:EP12788925
申请日:2012-05-23
Applicant: UNIV SINGAPORE
Inventor: CHUA LAY-LAY , HO PETER , PNG RUI-QI , KAM FONG YU , SONG JIE , WONG LOKE-YUEN , ZHUO JING-MEI , LOH KIAN PING , LIM GEOK-KIENG
CPC classification number: B32B37/025 , H01L21/2007 , Y10T428/30
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公开(公告)号:EP2507309A4
公开(公告)日:2013-07-03
申请号:EP10834852
申请日:2010-12-06
Applicant: UNIV SINGAPORE
Inventor: HO PETER , CHUA LAY-LAY , FRIEND RICHARD HENRY , TANG JIE-CONG , PNG RUI-QI , ANTO BIBIN THOMAS , CHIA PERQ-JON , TAN ZHI KUANG , CHOO KIM KIAN
IPC: C07C247/18 , C08J3/24 , C08K5/03 , C08K5/28
CPC classification number: C07C247/18 , C08K5/0025 , C08K5/28 , C09D201/04
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公开(公告)号:SG10201604044UA
公开(公告)日:2016-07-28
申请号:SG10201604044U
申请日:2012-05-23
Applicant: UNIV SINGAPORE
Inventor: CHUA LAY-LAY , HO PETER , PNG RUI-QI , KAM FONG YU , SONG JIE , WONG LOKE-YUEN , ZHUO JING-MEI , LOH KIAN PING , LIM GEOK-KIENG
Abstract: The present invention discloses a method for transferring a thin film from a first substrate to a second substrate comprising the steps of: providing a transfer structure and a thin film provided on a surface of a first substrate, the transfer structure comprising a support layer and a film contact layer, wherein the transfer structure contacts the thin film; removing the first substrate to obtain the transfer structure with the thin film in contact with the film contact layer; contacting the transfer structure obtained with a surface of a second substrate; and removing the film contact layer, thereby transferring the thin film onto the surface of the second substrate.
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公开(公告)号:SG195119A1
公开(公告)日:2013-12-30
申请号:SG2013086699
申请日:2012-05-23
Applicant: UNIV SINGAPORE
Inventor: CHUA LAY-LAY , HO PETER , PNG RUI-QI , KAM FONG YU , SONG JIE , WONG LOKE-YUEN , ZHUO JING-MEI , LOH KIAN PING , LIM GEOK-KIENG
Abstract: The present invention discloses a method for transferring a thin film from a first substrate to a second substrate comprising the steps of: providing a transfer structure and a thin film provided on a surface of a first substrate, the transfer structure comprising a support layer and a film contact layer, wherein the transfer structure contacts the thin film; removing the first substrate to obtain the transfer structure with the thin film in contact with the film contact layer; contacting the transfer structure obtained with a surface of a second substrate; and removing the film contact layer, thereby transferring the thin film onto the surface of the second substrate.
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