METHOD OF TRANSFERRING THIN FILMS

    公开(公告)号:SG10201604044UA

    公开(公告)日:2016-07-28

    申请号:SG10201604044U

    申请日:2012-05-23

    Applicant: UNIV SINGAPORE

    Abstract: The present invention discloses a method for transferring a thin film from a first substrate to a second substrate comprising the steps of: providing a transfer structure and a thin film provided on a surface of a first substrate, the transfer structure comprising a support layer and a film contact layer, wherein the transfer structure contacts the thin film; removing the first substrate to obtain the transfer structure with the thin film in contact with the film contact layer; contacting the transfer structure obtained with a surface of a second substrate; and removing the film contact layer, thereby transferring the thin film onto the surface of the second substrate.

    METHOD OF TRANSFERRING THIN FILMS

    公开(公告)号:SG195119A1

    公开(公告)日:2013-12-30

    申请号:SG2013086699

    申请日:2012-05-23

    Applicant: UNIV SINGAPORE

    Abstract: The present invention discloses a method for transferring a thin film from a first substrate to a second substrate comprising the steps of: providing a transfer structure and a thin film provided on a surface of a first substrate, the transfer structure comprising a support layer and a film contact layer, wherein the transfer structure contacts the thin film; removing the first substrate to obtain the transfer structure with the thin film in contact with the film contact layer; contacting the transfer structure obtained with a surface of a second substrate; and removing the film contact layer, thereby transferring the thin film onto the surface of the second substrate.

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