公开(公告)号：EP2715778A4

公开(公告)日：2014-11-19

申请号：EP12788925

申请日：2012-05-23

Applicant: UNIV SINGAPORE

Inventor： CHUA LAY-LAY ,  HO PETER ,  PNG RUI-QI ,  KAM FONG YU ,  SONG JIE ,  WONG LOKE-YUEN ,  ZHUO JING-MEI ,  LOH KIAN PING ,  LIM GEOK-KIENG

IPC: H01L21/00 ,  B32B7/00 ,  B32B27/00

CPC classification number: B32B37/025 ,  H01L21/2007 ,  Y10T428/30

公开(公告)号：EP2507309A4

公开(公告)日：2013-07-03

申请号：EP10834852

申请日：2010-12-06

Applicant: UNIV SINGAPORE

Inventor： HO PETER ,  CHUA LAY-LAY ,  FRIEND RICHARD HENRY ,  TANG JIE-CONG ,  PNG RUI-QI ,  ANTO BIBIN THOMAS ,  CHIA PERQ-JON ,  TAN ZHI KUANG ,  CHOO KIM KIAN

IPC: C07C247/18 ,  C08J3/24 ,  C08K5/03 ,  C08K5/28

CPC classification number: C07C247/18 ,  C08K5/0025 ,  C08K5/28 ,  C09D201/04

公开(公告)号：SG10201604044UA

公开(公告)日：2016-07-28

申请号：SG10201604044U

申请日：2012-05-23

Applicant: UNIV SINGAPORE

Inventor： CHUA LAY-LAY ,  HO PETER ,  PNG RUI-QI ,  KAM FONG YU ,  SONG JIE ,  WONG LOKE-YUEN ,  ZHUO JING-MEI ,  LOH KIAN PING ,  LIM GEOK-KIENG

Abstract: The present invention discloses a method for transferring a thin film from a first substrate to a second substrate comprising the steps of: providing a transfer structure and a thin film provided on a surface of a first substrate, the transfer structure comprising a support layer and a film contact layer, wherein the transfer structure contacts the thin film; removing the first substrate to obtain the transfer structure with the thin film in contact with the film contact layer; contacting the transfer structure obtained with a surface of a second substrate; and removing the film contact layer, thereby transferring the thin film onto the surface of the second substrate.

公开(公告)号：SG195119A1

公开(公告)日：2013-12-30

申请号：SG2013086699

申请日：2012-05-23

Applicant: UNIV SINGAPORE

Inventor： CHUA LAY-LAY ,  HO PETER ,  PNG RUI-QI ,  KAM FONG YU ,  SONG JIE ,  WONG LOKE-YUEN ,  ZHUO JING-MEI ,  LOH KIAN PING ,  LIM GEOK-KIENG

Abstract: The present invention discloses a method for transferring a thin film from a first substrate to a second substrate comprising the steps of: providing a transfer structure and a thin film provided on a surface of a first substrate, the transfer structure comprising a support layer and a film contact layer, wherein the transfer structure contacts the thin film; removing the first substrate to obtain the transfer structure with the thin film in contact with the film contact layer; contacting the transfer structure obtained with a surface of a second substrate; and removing the film contact layer, thereby transferring the thin film onto the surface of the second substrate.