公开(公告)号：WO2017087928A1

公开(公告)日：2017-05-26

申请号：PCT/US2016/063007

申请日：2016-11-21

Applicant: VESPER TECHNOLOGIES INC.

Inventor： LITRELL, Robert J.

IPC: H04R19/04 ,  H04R1/28

CPC classification number: H04R1/222 ,  H04R17/02 ,  H04R19/04 ,  H04R31/006 ,  H04R2499/11

Abstract: A package comprises: a transducer; a substrate comprising an acoustic port, with the transducer attached to a surface of the substrate and over or adjacent to the acoustic port; and a venting mechanism for venting air or sound pressure from a device comprising the package, with the venting mechanism being affixed to the substrate and partially surrounding the acoustic port, and with the venting mechanism being dimensioned to filter out audio frequencies.

Abstract translation: 包装包括：换能器; 包括声学端口的基底，其中所述换能器连接到所述基底的表面并且在所述声学端口上方或附近; 以及用于从包括包装的装置排出空气或声压的通气机构，其中通气机构固定到基底并且部分地围绕声学端口，并且通气机构的尺寸被设计为过滤掉音频。