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公开(公告)号:ZA9603176B
公开(公告)日:1996-10-25
申请号:ZA9603176
申请日:1996-04-22
Applicant: VIRIDIAN INC
Inventor: HAJMRLE KAREL , REID KENNETH G
CPC classification number: B22F1/025 , C25D7/00 , H05K3/3436 , H05K2201/10234 , H05K2201/10992 , H05K2203/041 , Y02P70/613
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公开(公告)号:ZA963176B
公开(公告)日:1996-10-25
申请号:ZA963176
申请日:1996-04-22
Applicant: VIRIDIAN INC
Inventor: HAJMRLE KAREL , REID KENNETH G
Abstract: PCT No. PCT/CA96/00254 Sec. 371 Date Oct. 17, 1997 Sec. 102(e) Date Oct. 17, 1997 PCT Filed Apr. 19, 1996 PCT Pub. No. WO96/33299 PCT Pub. Date Oct. 24, 1996An improved process for the manufacture of uniformly and accurately sized metal spheres, particularly copper spheres, which comprises the steps of classifying a starting lot of spheres into closely sized fractions; separately electroplating each size fraction to a desired final mean diameter and size distribution; and then combining the plated fractions to give a metal sphere product having the requisite mean particles size and size distribution. The electroplating build-up step is characterized by a high level of precision. Additional benefits derive from the high hardness of copper electroplate on relatively soft copper starting particles which facilitates grinding or polishing irregularly shaped plated particles down to the desired sphericity and mean diameter, from the ability of metal such as copper electroplate to cover and envelop contaminated surfaces of starting particles, and from the ability to produce spheres having a unique combination of bulk and surface properties.
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