公开(公告)号：WO2013000484A1

公开(公告)日：2013-01-03

申请号：PCT/DK2012/050242

申请日：2012-07-02

Applicant: VESTAS WIND SYSTEMS A/S ,  ABEYASEKERA, Tusitha ,  ANDERSEN, Thomas Lundgren ,  MØLLER, Henrik B. ,  STYHM, Ove

Inventor： ABEYASEKERA, Tusitha ,  ANDERSEN, Thomas Lundgren ,  MØLLER, Henrik B. ,  STYHM, Ove

IPC: H01L23/473 ,  H01L25/065 ,  H01L23/373

CPC classification number: H01L23/34 ,  H01L23/3735 ,  H01L23/46 ,  H01L23/473 ,  H01L23/4924 ,  H01L23/4926 ,  H01L23/585 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/13055 ,  H02B1/56 ,  H05K7/20 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A heat sink for cooling at least one power semiconductor module, and that includes a basin for containing a cooling liquid. The basin has a contact rim for receiving the base plate and that includes a surface that is sloped inwards to the basin.

Abstract translation: 一种用于冷却至少一个功率半导体模块的散热器，并且包括用于容纳冷却液体的盆。 盆地具有用于接收基板的接触边缘，并且包括向内倾斜到盆地的表面。

公开(公告)号：EP2727143B1

公开(公告)日：2018-04-11

申请号：EP12732961.3

申请日：2012-07-02

Applicant: Vestas Wind Systems A/S

Inventor： ABEYASEKERA, Tusitha ,  ANDERSEN, Thomas Lundgren ,  MØLLER, Henrik B. ,  STYHM, Ove

IPC: H01L23/34 ,  H01L23/473 ,  H01L25/065 ,  H01L23/373 ,  H01L23/00

CPC classification number: H01L23/34 ,  H01L23/3735 ,  H01L23/46 ,  H01L23/473 ,  H01L23/4924 ,  H01L23/4926 ,  H01L23/585 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/13055 ,  H02B1/56 ,  H05K7/20 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A heat sink for cooling at least one power semiconductor module, and that includes a basin for containing a cooling liquid. The basin has a contact rim for receiving the base plate and that includes a surface that is sloped inwards to the basin.

公开(公告)号：EP2727143A1

公开(公告)日：2014-05-07

申请号：EP12732961.3

申请日：2012-07-02

Applicant: Vestas Wind Systems A/S

Inventor： ABEYASEKERA, Tusitha ,  ANDERSEN, Thomas Lundgren ,  MØLLER, Henrik B. ,  STYHM, Ove

IPC: H01L23/473 ,  H01L25/065 ,  H01L23/373

CPC classification number: H01L23/34 ,  H01L23/3735 ,  H01L23/46 ,  H01L23/473 ,  H01L23/4924 ,  H01L23/4926 ,  H01L23/585 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/13055 ,  H02B1/56 ,  H05K7/20 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A heat sink for cooling at least one power semiconductor module, and that includes a basin for containing a cooling liquid. The basin has a contact rim for receiving the base plate and that includes a surface that is sloped inwards to the basin.

Abstract translation: 一种用于冷却至少一个功率半导体模块的散热器，并且包括用于容纳冷却液体的盆。 盆地具有用于接收底板的接触边缘，并且包括向内倾斜到盆地的表面。