公开(公告)号：WO2004100626A2

公开(公告)日：2004-11-18

申请号：PCT/FR2004/001105

申请日：2004-05-06

Applicant: WAVECOM ,  KORDJANI, Bachir ,  MEVAA, Charles

Inventor： KORDJANI, Bachir ,  MEVAA, Charles

IPC: H05K1/14

CPC classification number: H05K1/141 ,  H01L25/0652 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0237 ,  H05K1/0268 ,  H05K2201/10371 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00

Abstract: L'invention concerne un module de radiocommunication regroupant dans un boîtier d'encapsulation (12) un ensemble de composants (121, 122) rapportés sur un substrat (11), ledit substrat (11) étant équipé de moyens (14) pour le rapporter sur une carte de circuit imprimé, ledit substrat présentant une superficie supérieure à celle définie par ledit boîtier (12) et portant un ensemble de pistes et/ou de points d'accès, de façon à définir une plage d'accueil pour recevoir au moins un autre composant (31, 32, 33) et/ou permettre le test dudit boîtier, ledit substrat portant des moyens de report (14) sur une carte de circuit imprimé, de façon que ledit substrat permette également l'interconnexion avec ladite carte de circuit imprimé.

Abstract translation: 本发明涉及一种组合封装壳体（12）中的一组部件（121,122）的无线电通信模块，所述部件安装在基板（11）上。 上述基板（11）配备有用于将其安装到印刷电路板的装置（14）。 此外，衬底的表面大于由壳体（12）限定的表面，并且承载一组轨道和/或接入点，例如限定用于容纳至少一个其它部件（31， 32,33）和/或使得能够测试案件。 此外，基板承载用于将其定位在印刷电路板上的装置（14），使得基板也可以互连到所述印刷电路板。

公开(公告)号：WO2005018290A3

公开(公告)日：2005-02-24

申请号：PCT/FR2004/002134

申请日：2004-08-11

Applicant: WAVECOM ,  KORDJANI, Bachir ,  JOUAN, Jacky

Inventor： KORDJANI, Bachir ,  JOUAN, Jacky

IPC: H01L25/065

Abstract: L’invention concerne un module électronique caractérisé en ce qu’il est formé d’au moins deux composants empilés, chacun desdits composants présentant une pluralité de portions de piste tracées sur au moins un de leurs bords, des moyens d’assemblage assurant des liaisons électriques entre des portions de piste d’au moins deux composants.

公开(公告)号：EP1252804B1

公开(公告)日：2005-08-03

申请号：EP01903980.9

申请日：2001-01-26

Applicant: Wavecom

Inventor： KORDJANI, Bachir ,  JOUAN, Jacky

IPC: H05K9/00

CPC classification number: H05K9/0028 ,  H05K1/0218 ,  H05K1/0237 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/10378 ,  H05K2201/2018

Abstract: The invention concerns a radiocommunication equipment module (32), designed to be transferred onto a motherboard (31) comprising components mounted on a printed circuit and providing at least one of the following functions: RF processing, digital processing and analog processing. The invention is characterised in that the module comprises a set of conductive elements (35), distributed over said printed circuit lower surface, and arranged in such a manner that said set of conductive elements constitute simultaneously: electromagnetic shielding means for said printed circuit lower surface; electrical interconnecting means, enabling electric signals to pass through to and/or from said motherboard; and means for transferring said radiocommunication module onto said motherboard. Thus the radiocommunication module constitutes an electronic macro-component.

公开(公告)号：EP1252804A1

公开(公告)日：2002-10-30

申请号：EP01903980.9

申请日：2001-01-26

Applicant: Wavecom

Inventor： KORDJANI, Bachir ,  JOUAN, Jacky

IPC: H05K9/00

CPC classification number: H05K9/0028 ,  H05K1/0218 ,  H05K1/0237 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/10378 ,  H05K2201/2018

Abstract: The invention concerns a radiocommunication equipment module (32), designed to be transferred onto a motherboard (31) comprising components mounted on a printed circuit and providing at least one of the following functions: RF processing, digital processing and analog processing. The invention is characterised in that the module comprises a set of conductive elements (35), distributed over said printed circuit lower surface, and arranged in such a manner that said set of conductive elements constitute simultaneously: electromagnetic shielding means for said printed circuit lower surface; electrical interconnecting means, enabling electric signals to pass through to and/or from said motherboard; and means for transferring said radiocommunication module onto said motherboard. Thus the radiocommunication module constitutes an electronic macro-component.

公开(公告)号：EP1599903A2

公开(公告)日：2005-11-30

申请号：EP04716631.9

申请日：2004-03-03

Applicant: Wavecom

Inventor： JOUAN, Jacky ,  KORDJANI, Bachir

IPC: H01L23/552 ,  H01L25/16 ,  H05K9/00

CPC classification number: H05K3/403 ,  H01L23/3121 ,  H01L23/49805 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/141 ,  H05K1/185 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/4644 ,  H05K2201/09436 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/4913 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention relates to a method for producing a component or a module comprising a component assembly arranged on a substrate in a housing which is mountable on a printed circuit. The inventive method consists of at least one stage when at least one part of the module is coated with an insulating material, and at least one stage when at least one conductive area is produced on one part of said insulating material in such a way that the areas forming and/or receiving at least one part of the component and/or at least one interconnection element are defined.

公开(公告)号：WO2004082022A2

公开(公告)日：2004-09-23

申请号：PCT/FR2004/000505

申请日：2004-03-03

Applicant: WAVECOM ,  JOUAN, Jacky ,  KORDJANI, Bachir

Inventor： JOUAN, Jacky ,  KORDJANI, Bachir

IPC: H01L23/552

CPC classification number: H05K3/403 ,  H01L23/3121 ,  H01L23/49805 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/141 ,  H05K1/185 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/4644 ,  H05K2201/09436 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/4913 ,  H01L2224/45015 ,  H01L2924/207

Abstract: L'invention concerne un procédé de fabrication d'un composant ou d'un module regroupant dans un boîtier prêt à monter sur circuit imprimé un ensemble de composants montés sur un substrat comprenant au moins une étape d'enrobage à l'aide d'un matériau isolant d'au moins une partie dudit module et au moins une étape de réalisation, sur une partie dudit matériau isolant, d'au moins une zone conductrice, de façon à définir des zones formant et/ou pouvant recevoir au moins une partie d'un composant et/ou au moins un élément d'interconnexion.

Abstract translation: 本发明涉及一种用于制造组件或模块的方法，其包括布置在可安装在印刷电路上的壳体中的基板上的部件组件。 本发明的方法包括至少一个阶段，当模块的至少一部分被绝缘材料涂覆时，以及至少一个阶段，当在所述绝缘材料的一部分上产生至少一个导电区域时， 定义形成和/或接收部件和/或至少一个互连元件的至少一部分的区域。

公开(公告)号：EP1275281A1

公开(公告)日：2003-01-15

申请号：EP01928014.8

申请日：2001-04-19

Applicant: Wavecom

Inventor： JOUAN, Jacky ,  KORDJANI, Bachir

IPC: H05K9/00

CPC classification number: H05K9/0024 ,  H05K1/141 ,  H05K3/284 ,  Y10T428/249962

Abstract: The invention concerns a method for shielding at least the upper part of a radiocommunication module (1), said module being designed to be transferred on a mother board (5) and including components mounted on a printed circuit and providing at least one of the following functions. RF processing, digital processing and analog processing. The inventive method is characterised in that it comprises the following steps: coating at least the upper part (2) of said radiocommunication module with a resin and adding an electrically conductive layer at the surface of the resin. The invention also concerns a radiocommunication module whereof at least the upper part is thus shielded.