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1.发明申请Continuous Microscale Forming of Metal-Based Microchannels and Other Microchannel Devices 有权金属微通道和其他微通道器件的连续微观形成公开(公告)号：US20110174040A1
公开(公告)日：2011-07-21
申请号：US13006951
申请日：2011-01-14
Applicant: Wen Jin Meng , Fanghua Mei
Inventor： Wen Jin Meng , Fanghua Mei
CPC classification number: B81C1/00071 , B81C2201/034
Abstract: A process is disclosed for producing metal-based, high-aspect-ratio microscale structures (HARMs), for example microchannels in a heat exchanger. The preferred manufacturing method operates in a continuous mode, and employs low-temperature rolling of metals. A process is disclosed for bonding metal microchannel sheets or plates to flat metal sheets or plates to form single-, double-, and multiple-layered microchannel structures. The process can operate at much lower temperatures than prior methods of compression microscale molding of metals, at room temperature or even lower.
Abstract translation: 公开了用于生产金属基高纵横比微结构（HARM）的方法，例如热交换器中的微通道。 优选的制造方法以连续模式操作，并且采用金属的低温轧制。 公开了一种用于将金属微通道片或板接合到平板金属片或板以形成单层，双层和多层微通道结构的方法。 该方法可以在比现有的金属压缩微细成型方法低得多的温度下操作，在室温甚至更低的温度下。
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Patent Agency Ranking
2.发明授权Microscale compression molding of metals with surface engineered LIGA inserts 有权表面处理LIGA插件的金属微尺寸压缩成型公开(公告)号：US07114361B2
公开(公告)日：2006-10-03
申请号：US10660926
申请日：2003-09-12
Applicant: Wen Jin Meng
Inventor： Wen Jin Meng
IPC: B21D22/00
CPC classification number: B81C99/009 , B81C1/00619 , B81C2201/034
Abstract: An inexpensive method of rapidly fabricating reactive metal (Zn, Al, Al-alloy, etc.) microscale structures including high-aspect-ratio microscale structures is disclosed. A high precision process uses conformal bond inhibitor coating and high temperature compression molding techniques to produce high quality, high aspect ratio metal structures. In one embodiment, following fabrication of an initial metallic microscale mold insert, an adhesion-promoting metal precursor layer and a ceramic bond inhibitor coating are conformally deposited onto the microscale mold insert. The microscale mold insert and a preselected reactive metal are then heated to an optimum temperature and compressed together. The mold insert is then extracted from the molded metal to produce a reverse image of the mold insert.
Abstract translation: 公开了一种快速制造包括高纵横比微结构的反应性金属（Zn，Al，Al-合金等）微结构的廉价方法。 高精度工艺使用保形键合抑制剂涂层和高温压缩成型技术来生产高质量，高纵横比的金属结构。 在一个实施例中，在制造初始金属微量模具插入件之后，将粘附促进金属前体层和陶瓷粘结抑制剂涂层共形沉积到微型模具插入件上。 然后将微型模具插件和预选的活性金属加热至最佳温度并压缩。 然后从模制金属中提取模具插件以产生模具插入件的反向图像。
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3.发明申请METAL-BASED MICROCHANNEL HEAT EXCHANGERS MADE BY MOLDING REPLICATION AND ASSEMBLY 有权基于金属的微通道热交换器通过模制复制和组装公开(公告)号：US20160161195A1
公开(公告)日：2016-06-09
申请号：US15010162
申请日：2016-01-29
Applicant: Wen Jin Meng , Fanghua Mei
Inventor： Wen Jin Meng , Fanghua Mei
IPC: F28F1/00 , H01L21/48 , H01L23/367 , H01L23/473
CPC classification number: F28F1/00 , B81B2201/058 , B81C99/0085 , B81C2203/038 , F28F3/12 , F28F21/08 , F28F2260/02 , H01L21/4882 , H01L23/3675 , H01L23/473 , H01L2924/0002 , H01L2924/00
Abstract: Compression molding of metals is used to make microchannel heat exchangers. Heat transfer can be improved by employing controlled microchannel surface roughness. Flux-free bonding is achieved using a eutectic thin-film intermediate layer. Seals are leak-tight, mechanically strong, and uniform across multiple contact areas. The metal heat exchangers may be mass-produced inexpensively, and are useful for applications including the cooling of computer chips and other high-power electronic devices, air conditioning, refrigeration, condenser plates, radiators, fuel cell heat management, and instant water heating.
Abstract translation: 金属的压缩成型用于制造微通道热交换器。 通过采用受控的微通道表面粗糙度可以改善传热。 使用共晶薄膜中间层实现无焊接接合。 密封密封，机械强度高，并且在多个接触区域均匀。 金属热交换器可以廉价地批量生产，并且可用于包括冷却计算机芯片和其他大功率电子设备，空调，制冷，冷凝器板，散热器，燃料电池热管理和即时水加热的应用。
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4.发明申请Metal-Based Microchannel Heat Exchangers Made by Molding Replication and Assembly 审中-公开基于金属的微通道热交换器通过成型复制和组装制成公开(公告)号：US20100288479A1
公开(公告)日：2010-11-18
申请号：US12812556
申请日：2009-01-13
Applicant: Wen Jin Meng , Fanghua Mei
Inventor： Wen Jin Meng , Fanghua Mei
CPC classification number: F28F1/00 , B81B2201/058 , B81C99/0085 , B81C2203/038 , F28F3/12 , F28F21/08 , F28F2260/02 , H01L21/4882 , H01L23/3675 , H01L23/473 , H01L2924/0002 , H01L2924/00
Abstract: Compression molding of metals is used to make microchannel heat exchangers. Heat transfer can be improved by employing controlled microchannel surface roughness. Flux-free bonding is achieved using a eutectic thin-film intermediate layer. Seals are leak-tight, mechanically strong, and uniform across multiple contact areas. The metal heat exchangers may be mass-produced inexpensively, and are useful for applications including the cooling of computer chips and other high-power electronic devices, air conditioning, refrigeration, condenser plates, radiators, fuel cell heat management, and instant water heating.
Abstract translation: 金属的压缩成型用于制造微通道热交换器。 通过采用受控的微通道表面粗糙度可以改善传热。 使用共晶薄膜中间层实现无焊接接合。 密封密封，机械强度高，并且在多个接触区域均匀。 金属热交换器可以廉价地批量生产，并且可用于包括冷却计算机芯片和其他大功率电子设备，空调，制冷，冷凝器板，散热器，燃料电池热管理和即时水加热的应用。
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公开(公告)号：US09891006B2
公开(公告)日：2018-02-13
申请号：US15010162
申请日：2016-01-29
Applicant: Wen Jin Meng , Fanghua Mei
Inventor： Wen Jin Meng , Fanghua Mei
IPC: F28F13/18 , F28F1/00 , B81C99/00 , F28F3/12 , F28F21/08 , H01L21/48 , H01L23/473 , H01L23/367
CPC classification number: F28F1/00 , B81B2201/058 , B81C99/0085 , B81C2203/038 , F28F3/12 , F28F21/08 , F28F2260/02 , H01L21/4882 , H01L23/3675 , H01L23/473 , H01L2924/0002 , H01L2924/00
Abstract: Compression molding of metals is used to make microchannel heat exchangers. Heat transfer can be improved by employing controlled microchannel surface roughness. Flux-free bonding is achieved using a eutectic thin-film intermediate layer. Seals are leak-tight, mechanically strong, and uniform across multiple contact areas. The metal heat exchangers may be mass-produced inexpensively, and are useful for applications including the cooling of computer chips and other high-power electronic devices, air conditioning, refrigeration, condenser plates, radiators, fuel cell heat management, and instant water heating.
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6.发明授权Continuous microscale forming of metal-based microchannels and other microchannel devices 有权金属微通道和其他微通道器件的连续微量成型公开(公告)号：US08857234B2
公开(公告)日：2014-10-14
申请号：US13006951
申请日：2011-01-14
Applicant: Wen Jin Meng , Fanghua Mei
Inventor： Wen Jin Meng , Fanghua Mei
CPC classification number: B81C1/00071 , B81C2201/034
Abstract: A process is disclosed for producing metal-based, high-aspect-ratio microscale structures (HARMs), for example microchannels in a heat exchanger. The preferred manufacturing method operates in a continuous mode, and employs low-temperature rolling of metals. A process is disclosed for bonding metal microchannel sheets or plates to flat metal sheets or plates to form single-, double-, and multiple-layered microchannel structures. The process can operate at much lower temperatures than prior methods of compression microscale molding of metals, at room temperature or even lower.
Abstract translation: 公开了用于生产金属基高纵横比微结构（HARM）的方法，例如热交换器中的微通道。 优选的制造方法以连续模式操作，并且采用金属的低温轧制。 公开了一种用于将金属微通道片或板接合到平板金属片或板以形成单层，双层和多层微通道结构的方法。 该方法可以在比现有的金属压缩微细成型方法低得多的温度下操作，在室温甚至更低的温度下。
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