公开(公告)号：US10483235B2

公开(公告)日：2019-11-19

申请号：US15057973

申请日：2016-03-01

Applicant: Winbond Electronics Corp.

Inventor： Yu-Cheng Chiao ,  Tung-Yi Chan ,  Chen-Hsi Lin ,  Chia Hua Ho ,  Meng-Chang Chan ,  Hsin-Hung Chou

IPC: H01L25/065

Abstract: A method for fabricating a stacked electronic device is provided. A first three-dimensional (3D) printing is performed to form a first insulating layer and a plurality of first redistribution layers (RDLs) on a first substrate. A second 3D printing is performed to form a second substrate and a plurality of through-substrate vias (TSVs) on the first insulating layer, in which the plurality of TSVs is electrically connected to the plurality of first RDLs. A third 3D printing is performed to form a second insulating layer and a plurality of second RDLs on the second substrate, in which the plurality of second RDLs is electrically connected to the plurality of TSVs. A plurality of contacts of a third substrate is bonded to the plurality of second RDLs, so that the substrate is mounted onto the second insulating layer. The disclosure also provides a stacked electronic device formed by such a method.

公开(公告)号：US09881901B2

公开(公告)日：2018-01-30

申请号：US15015919

申请日：2016-02-04

Applicant: WINBOND ELECTRONICS CORP.

Inventor： Yu-Cheng Chiao ,  Tung-Yi Chan ,  Chen-Hsi Lin ,  Chia Hua Ho ,  Meng-Chang Chan ,  Hsin-Hung Chou

IPC: H01L21/44 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L25/50 ,  H01L2224/48091 ,  H01L2225/06506 ,  H01L2225/06582 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A method for fabricating a stacked package device is provided. A second substrate is adhered onto a first substrate. The first substrate includes a plurality of first bonding pads, and the second substrate includes a plurality of second bonding pads. A three-dimensional (3D) printing is performed to form an encapsulating layer covering the first substrate and the second substrate and to form a plurality of bonding wires in the encapsulating layer. Each bonding wire includes a first portion connected to one of the plurality of first bonding pads. The disclosure also provides a stacked package device formed by such a method.