公开(公告)号：US10685883B1

公开(公告)日：2020-06-16

申请号：US16402216

申请日：2019-05-02

Applicant: Winbond Electronics Corp.

Inventor： Cheng-Hong Wei ,  Hung-Sheng Chen ,  Ching-Wei Chen ,  Shuo-Che Chang

IPC: H01L21/78 ,  H01L23/544 ,  H01L23/00 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/3213 ,  H01L21/66

Abstract: A method of wafer dicing and a die are provided. The method includes the following processes. A wafer is provided, the wafer includes a plurality of die regions and a scribe region between the die regions. The scribe region includes a substrate, and a dielectric layer and a test structure on the substrate, the test structure is disposed in the dielectric layer. A first removal process is performed to remove the test structure and the dielectric layer around the test structure, so as to expose the substrate. The first removal process includes performing a plurality of etching cycles, and each etching cycle includes performing a first etching process to remove a portion of the test structure and performing a second etching process to remove a portion of the dielectric layer. A second removal process is performed to remove the substrate in the scribe region, so as to form a plurality of dies separated from each other.

公开(公告)号：US10515853B1

公开(公告)日：2019-12-24

申请号：US16215584

申请日：2018-12-10

Applicant: Winbond Electronics Corp.

Inventor： Ching-Wei Chen ,  Cheng-Hong Wei ,  Shuo-Che Chang ,  Hung-Sheng Chen ,  Hsin-Hung Chou

IPC: H01L21/78 ,  H01L23/544 ,  H01L21/66 ,  H01L21/3065 ,  H01L21/683 ,  H01L21/304 ,  H01L21/784

Abstract: A method of wafer dicing is provided. The method of wafer dicing includes: providing a wafer, wherein the wafer includes a substrate, dies formed in and over the substrate and a scribe line structure located in a scribe line region between adjacent dies; removing a portion of the scribe line structure around a test device in the scribe line structure; attaching a front side of the wafer with a first tape; removing a portion of the substrate overlapping with the scribe line region from a back side of the wafer; attaching the back side of the wafer with a second tape; and removing the first tape along with the remaining portion of the scribe line structure attached thereon, leaving the dies separately attached on the second tape.