公开(公告)号：US20250151204A1

公开(公告)日：2025-05-08

申请号：US18936456

申请日：2024-11-04

Applicant: Worcester Polytechnic Institute

Inventor： Pratap Rao ,  Ritwik Pandey ,  Ceren Yilmaz Akkaya ,  Markus P. Nemitz ,  Cem Aygul

IPC: H05K3/10 ,  H05K3/04 ,  H05K3/06

Abstract: A surface treatment of a printed trace improves electrical conductivity at a contact area defining an insertion or engagement of a circuit element. Mechanical and chemical treatment at a contact area of an extruded trace generated from 3-dimensional (3D) printing techniques mitigates resistance of the surface. A conductive trace may be extruded from a conductive filament material including conductive granules, flakes or powder. A solvent or etchant applied to the extruded surface at the contact point removes, dissolves or otherwise abrades the contact area. A mechanical drilling or incision may also be applied. Dissolution of the non-conductive material exposes the conductive material for improved contact with a conductive epoxy or paste applied to the contact area for receiving a conductive terminal (pin or pad) from a circuit element.