公开(公告)号：US5409155A

公开(公告)日：1995-04-25

申请号：US52479

申请日：1993-04-23

Applicant: Wun-Shyong Chen

Inventor： Wun-Shyong Chen

IPC: B23K1/008 ,  B23K1/06 ,  H05K3/34

CPC classification number: B23K1/008 ,  B23K1/06 ,  H05K3/341 ,  B23K2201/42 ,  H05K2203/0292 ,  H05K2203/048 ,  H05K2203/1509 ,  H05K3/3421 ,  H05K3/3494 ,  Y02P70/613

Abstract: A method and apparatus for soldering areas of two parts together such as solder leads of an electronic component to the solder pads on a printed circuit board which includes the step of raising the temperature of the abutting areas to a value greater than the melting temperature of the solder and while at the elevated temperature, vibrating the parts to align (center) the areas with respect to one another. Accordingly a reflow oven designed to practice this invention includes a conveyor system with three continuous belts leading in series from the entrance to the exit of the oven. The first belt carries the parts through a temperature zone where melting of the binder occurs; the second belt carries the parts through a hotter zone where melting of the solder and vibration to effect centering occurs; the third belt carries the part through the cooling zone. Separation of the belt into three isolated sections prevents disturbance of the parts when they are located in areas where the solder is not molten.

Abstract translation: 一种用于将两部分的区域焊接在一起的方法和装置，例如电子部件的焊接引线到印刷电路板上的焊盘，其包括将邻接区域的温度升高到大于 焊料，而在升高的温度下，振动部件使其相对于彼此对准（居中）。 因此，设计用于实施本发明的回流炉包括具有三个连续带的输送机系统，其从入口到炉的出口串联。 第一带携带部件通过粘合剂熔化的温度区域; 第二带通过较热的区域运送部件，其中发生焊料的熔化和振动以实现定心; 第三皮带将部件穿过冷却区域。 将带分离成三个隔离部分，当它们位于焊料不熔化的区域时，可以防止部件的干扰。