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    METHOD OF OPTICAL APERTURE INTEGRATION FOR PRODUCING SYMMETRIC IRRADIANCE PATTERN
    1.
    发明申请
    METHOD OF OPTICAL APERTURE INTEGRATION FOR PRODUCING SYMMETRIC IRRADIANCE PATTERN 审中-公开

    公开(公告)号：WO2021108440A1

    公开(公告)日：2021-06-03

    申请号：PCT/US2020/062071

    申请日：2020-11-24

    Applicant: X DEVELOPMENT LLC

    Inventor： KIM, Nam-hyong ,  ERKMEN, Baris ,  KAZMIERSKI, Andrei ,  BRINKLEY, Devin ,  MOODY, John ,  DEMARTINI, Markus ,  LAI, Wei-cheng ,  BALCH, Halleh

    IPC: H04B10/112

    Abstract: Aspects of the disclosure provide an optical communication system 100. The system 100 may include a receiver lens system 142 configured to receive a light beam from a remote optical communication system and direct the light beam to a photodetector 146. The system may also include the photodetector 146. The photodetector 146 may be configured to convert the received light beam into an electrical signal, and the photodetector 146 may be positioned at a focal plane of the receiver lens system 142. The system may also include a phase aberrating element 310 arranged with respect to the receiver lens system 142 and the photodetector 146 such that the phase-aberrating element 310 is configured to provide uniform angular irradiance at the focal plane of the receiver lens system 142.

    INTEGRATED ON-CHIP WIRELESS OPTICAL COMMUNICATION TERMINAL
    2.
    发明申请
    INTEGRATED ON-CHIP WIRELESS OPTICAL COMMUNICATION TERMINAL 审中-公开

    公开(公告)号：WO2023048876A1

    公开(公告)日：2023-03-30

    申请号：PCT/US2022/041180

    申请日：2022-08-23

    Applicant: X DEVELOPMENT LLC

    Inventor： ERKMEN, Baris, Ibrahim ,  BRINKLEY, Devin ,  EPP, Paul ,  MOODY, John

    IPC: H04B10/11

    Abstract: A free-space optical communication system includes an optical phased array (OPA) photonic integrated chip (114), a transceiver photonic integrated chip (112), and one or more processors (104). The OPA chip includes a plurality of array elements (120) and a plurality of phase shifters (121). The transceiver chip includes one or more transmitter components (116) and one or more receiver components (118). The one or more processors are configured to transmit a first signal via the OPA chip and the transceiver chip (402), and receive a second signal via the OPA chip and the transceiver chip (410).

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