Part design geometry for stenciling epoxies through orifices in film adhesive

    公开(公告)号:US10377133B2

    公开(公告)日:2019-08-13

    申请号:US15605706

    申请日:2017-05-25

    Abstract: A method of manufacturing a print head includes forming a jet stack, the jet stack including a nozzle plate having an array of nozzles, attaching an array of transducers to the jet stack, wherein the array of transducers has a transducer corresponding to each nozzle, adhering an adhesive layer to the array of transducers, forming opening in the adhesive layer, each opening adjacent a transducer in the array of transducers, partially removing the adhesive layer in regions adjacent the openings, such that the adhesive layer is less thick in the regions adjacent the openings than in other regions, and filling the openings with a conductive material, such that when the conductive material is applied, any air in the openings moves into the regions of the adhesive layer with less thickness adjacent the openings.

    FLEX CIRCUIT BOARD WITH TOPOGRAPHICAL STRUCTURES TO FACILITATE FLUID FLOW THROUGH THE LAYER
    4.
    发明申请
    FLEX CIRCUIT BOARD WITH TOPOGRAPHICAL STRUCTURES TO FACILITATE FLUID FLOW THROUGH THE LAYER 有权
    具有地层结构的柔性电路板,通过层来促进流体流动

    公开(公告)号:US20160039205A1

    公开(公告)日:2016-02-11

    申请号:US14454186

    申请日:2014-08-07

    CPC classification number: H05K1/028 B41J2/14233

    Abstract: A flex circuit board provides islands of electrically isolated material surrounding openings in the flex circuit board to preserve fluid integrity of passageways passing through an electrically insulating layer of the flex circuit board. The electrically isolated islands surround exits of the passageways through the electrically insulating material and extend the passageways through an electrically conductive layer of the flex circuit board. Consequently, fluid passing through the passageways and electrically isolated islands in the flex circuit board is not subjected to electrical current.

    Abstract translation: 柔性电路板提供围绕柔性电路板中的开口的电隔离材料岛,以保持通过柔性电路板的电绝缘层的通路的流体完整性。 电隔离的岛环绕通过电绝缘材料的通道的出口,并且将通道延伸穿过柔性电路板的导电层。 因此,柔性电路板中通过通道和电隔离岛的流体不受电流的影响。

    Flex circuit board with topographical structures to facilitate fluid flow through the layer
    7.
    发明授权
    Flex circuit board with topographical structures to facilitate fluid flow through the layer 有权
    具有形状结构的Flex电路板,以促进流体流过层

    公开(公告)号:US09238365B1

    公开(公告)日:2016-01-19

    申请号:US14454186

    申请日:2014-08-07

    CPC classification number: H05K1/028 B41J2/14233

    Abstract: A flex circuit board provides islands of electrically isolated material surrounding openings in the flex circuit board to preserve fluid integrity of passageways passing through an electrically insulating layer of the flex circuit board. The electrically isolated islands surround exits of the passageways through the electrically insulating material and extend the passageways through an electrically conductive layer of the flex circuit board. Consequently, fluid passing through the passageways and electrically isolated islands in the flex circuit board is not subjected to electrical current.

    Abstract translation: 柔性电路板提供围绕柔性电路板中的开口的电隔离材料岛,以保持通过柔性电路板的电绝缘层的通路的流体完整性。 电隔离的岛环绕通过电绝缘材料的通道的出口,并且将通道延伸穿过柔性电路板的导电层。 因此,柔性电路板中通过通道和电隔离岛的流体不受电流的影响。

Patent Agency Ranking